| PART |
Description |
Maker |
| IC264-22501-1 IC264-22501-1-MF IC264-22501-1-NN IC |
Ball Grid Array (BGA, 1.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| ECG2351 ECG2352 ECG2353 ECG2355 ECG2356 ECG2357 EC |
FAN AC 60X30 230V BALL, 11cfm
FAN AC 80X38 120/230V BALL, 25cfm
FAN AC 80X38 120/230V BALL, 18cfm
FAN AC 80X35 115V BALL, 31cfm
FAN AC 80X38 115V BALL, 23cfm
FAN AC 80X38 115V BALL, 17cfm
FAN AC 80X38 220V BALL, 31cfm
FAN AC 60X30 115V BALL, 11cfm
FAN AC 80X38 120/230V BALL, 13cfm
FAN AC 254MM(10'') 230V, 700cfm
FAN AC 254MM(10'') 230V, 555cfm
FAN AC 254MM,10'' 230V BALL, 547cfm
FAN AC 254MM(10'') 230V, 600cfm
FAN AC 80X35 115V BALL, 23cfm 晶体管|晶体管|进步党| 50V五（巴西）总裁| 100mA的一（c）|2VAR
FAN AC 254MM(10") 115V, 600cfm
FAN AC 80X38 220V BALL, 17cfm
|
|
| CHC-CH4ALF-01-1002-D-A CHC-CH8ALF-01-1002-D-A CHC- |
Precision Ceramic Ball Grid Arrays
|
IRC - a TT electronics Company.
|
| CSPESD304 |
4-Channel ESD Array in CSP
|
California Micro Devices
|
| AS4C64M16D3A-12BIN AS4C64M16D3A-12BCN |
96 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| M6MGB64BS8BWG M6MGT64BS8BWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
