| PART |
Description |
Maker |
| BL-SX1132 |
GaP/GaP Hi-Eff Green Low power consumption.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-B2134J |
LED GaP/GaP Green Low current requirement High efficiency.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-B21V1X |
LED GaP/GaP Green Low current requirement. 发光二极管镓/镓绿色低电流的要求
|
Bright LED Electronics Corp.
Bright LED Electronics, Corp.
|
| BL-B21V1G-L |
LED GaP/GaP Green Low current requirement.
|
BRIGHT LED ELECTRONICS CORP
|
| BL-B21V5D |
LED GaP/GaP Green Low current requirement.
18 Bit System Integrating A/D Processor, 16L WIDE SOIC
|
Bright LED Electronics Corp.
|
| BM-20EG57MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG88MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-41EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-20EG88MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG58MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
