| PART |
Description |
Maker |
| 319FJ044M16 |
EMI/RFI Shield Sock Shrink Boot Adapter
|
Glenair, Inc.
|
| GAP-027 |
319 SERIES SWING ARM CLAMP SHIELD SOCK TERMINATION PROCEDURE
|
Glenair, Inc.
|
| M85049-92-09J M85049-92-09M M85049-92-09T M85049-9 |
Composite Strain Reliefs Self-Locking
|
Glenair, Inc.
|
| 447AS327XM08 447FS327XM08 447LS327XM08 447SS327XM0 |
Composite Standard Profile EMI/RFI Banding Backshell with Qwik-Ty垄莽 Strain Relief
Composite Standard Profile EMI/RFI Banding Backshell with Qwik-Ty? Strain Relief
|
Glenair, Inc.
|
| 447AS657XW10 |
Composite Low-Profile Micro Band-in-a-Can Backshell with Strain-Relief Clamp
|
Glenair, Inc.
|
| 390LW052XM08 390LW052XM09 390LW052XM10 390LW052XM1 |
Composite Cone and Ring Style EMI/RFI Environmental Shield Termination Backshell
|
Glenair, Inc.
|
| 447LW330XM08 447LW330XM10 447LW330XM12 447LW330XM1 |
Composite Non-Environmental EMI/RFI Band-in-a-Can Backshell with Qwik-Clamp Strain-Relief
|
Glenair, Inc.
|
| 74651-1112 |
2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Shield Pin End Version, Advanced Mate Shield, 60 Circuits
|
Molex Electronics Ltd.
|
| XN04212 XN4212 |
Silicon NPN epitaxial planer transistor
Composite Device - Composite Transistors
|
Panasonic Semiconductor
|
| 0746971104 74697-1104 |
2.00mm (.079) Pitch 5-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Shield Pin End Version, Advanced Mate Shield, 40 Circuits
MOLEX Connector
|
Molex Electronics Ltd.
|
