| PART |
Description |
Maker |
| WS128K32NV-17H1MA WS128K32NV-17H1C WS128K32NV-17H1 |
128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| CYM1828HG-25C |
32K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
|
Intersil, Corp.
|
| MM196 |
6 MOSFET Multi-Chip Module
|
Microsemi Corporation
|
| MC-7883 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-7896-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-7884 MC-7884-15 |
GaAs MULTI-CHIP MODULE
|
NEC
Quanzhou Jinmei Electro...
|
| OMH410 |
100V Hi-Rel Multi-Chip MOSFET Half-Bridge Module in a MP-3 package
|
International Rectifier
|
| WEDPNF8M721V-1010BC WEDPNF8M721V-1010BI WEDPNF8M72 |
8Mx72 Synchronous DRAM 8Mb Flash Mixed Module Multi-Chip Package
|
White Electronic Designs
ETC[ETC]
|
| SMFLHP283R3S SMFLHP2805D SMFLHP2812D SMFLHP2805D07 |
Parallel operation with current share, up to 3 units (228 watts)
2-OUTPUT 100 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
2-OUTPUT 80 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
|
Interpoint Corporation Company
Standard Power
|
| SKY77601 |
Multi-Mode Multi-Band Power Amplifier Module
|
Skyworks Solutions
|
| WS512K8L-20CM WS512K8L-20CQA WS512K8-XCX WS512K8-2 |
512K X 8 MULTI DEVICE SRAM MODULE, 45 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 35 ns, CDIP32
512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CDIP32
512Kx8 SRAM MODULE, SMD 5962-92078
|
WEDC[White Electronic Designs Corporation]
|
|
