| PART |
Description |
Maker |
| 16188 16188-7 |
THERMAL INTERFACE PAD, (MAXI) 热接口垫，（马西
THERMAL INTERFACE PAD (MAXI)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| H48-6C |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| HSP-7 |
Thermal Pad suitable for NOVA22 Panel Mount SSRs
|
Crydom Inc.,
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| AT30TSE758-MA8-T |
Board Mount Temperature Sensors TMP SENSOR
|
Atmel, Corp.
|
| TC1068 |
SMBus Thermal Sensor
The TC1068 is a serially programmable temperature sensor optimized for monitoring modern high performance CPUs with on-board integrated thermal diodes. Temperature data is converted from the CPU’s thermal diode outputs and made avail
|
Microchip Technology
|
| KD3004-DC70A KD3003-DF10A |
Thick film thermal printhead (with thermal historical control)
Compact high speed thick film thermal printhead (12 dots / mm)
|
ROHM[Rohm]
|
| KF2003-GM50A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| SE2004-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
