| PART |
Description |
Maker |
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| 5SMX12K1273 |
IGBT-Die 75 A, 1200 V, N-CHANNEL IGBT
|
ABB, Ltd.
The ABB Group
ABB Semiconductors
|
| 5SMY12M1200 |
IGBT-Die
|
The ABB Group
|
| IGC10R60D |
600 V, N-CHANNEL IGBT 3.73 X 2.70 MM, DIE-2
|
Infineon Technologies AG
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| IRG4CH50UB |
IRG4CH50UB IGBT Die in Wafer Form
|
Fairchild Semiconductor, Corp.
International Rectifier
|
| IRG4CH50KB |
IRG4CH50KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CH40UB |
IRG4CH40UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC72KB |
IRG4CC72KB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC30UB |
IRG4CC30UB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10SB |
IRG4CC10SB IGBT Die in Wafer Form
|
International Rectifier
|
| IRG4CC10UB |
IRG4CC10UB IGBT Die in Wafer Form
|
International Rectifier
|
