| PART |
Description |
Maker |
| CYW312OXC CYW312OXCT W312-02 W312-02HT |
FTG for VIA K7 Series Chipset with Programmable Output Frequency
FTG for VIA⑩ K7 Series Chipset with Programmable Output Frequency
|
SpectraLinear Inc
|
| 2CW032200JL 2CW032082JL 2CW032510JL 2CW032300JL 2C |
2CW032XXXJL SERIES ZENER DIODE CHIPS FOR PLASTIC PACKAGE
2CW032XXXJL SERIES ZENER DIODE CHIPS FOR PLASTIC PACKAGE
|
Silan Microelectronics ...
Silan Microelectronics Joint-stock
|
| CY2832402 CY28324PVC |
FTG for Intel® Pentium® 4 CPU and Chipsets
FTG for Intel㈢ Pentium㈢ 4 CPU and Chipsets
|
Cypress Semiconductor
|
| SCS202NF |
Dual Series Chips Surface Mount Switching Diode
|
SeCoS Halbleitertechnologie GmbH
|
| SCS202PF |
Dual Series Chips Surface Mount Switching Diode
|
SeCoS Halbleitertechnologie GmbH
|
| CF001 CF001-02 CF001-03 CF001-01 |
CF001 SERIES GAAS PSEUDOMORPHIC HEMT AND MESFET CHIPS
|
Electronic Theatre Controls, Inc.
|
| W56932CY |
This series of chips is designed for the ringtone application of mobile phones with MIDI music and A
|
Winbond Electronics Corp America
|
| LDD-E304NI |
0.30 SEVEN SEGMENT, DUAL DIGIT DISPLAY, 635nm RED CHIPS, GRAY FACE WITH WHITE SEGMENTS, COMMON ANODE, NO CHIPS IN DECIMALS.
|
List of Unclassifed Manufacturers
|
| CY28416 CY28416OXC CY28416OXCT |
Next-Generation FTG for Intel® Architecture
Next Generation FTG for Intel-R Architecture
|
Cypress Semiconductor
|
| BM-41EG57MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG58MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
