PART |
Description |
Maker |
M6MGT647M34CKT M6MGB647M34CKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
M6MGT641S8BKT M6MGB641S8BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
F4294-09 |
MCP ASSEMBLY WITH CENTER HOLE FOR REFLECTRON MS
|
Hamamatsu Photonics HAMAMATSU[Hamamatsu Corporation]
|
AM49DL640BG25IS AM49DL640BG25IT AM49DL640BG35IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 堆叠式多芯片封装(MCP)闪存和SRAM
|
Spansion, Inc. Spansion Inc. Advanced Micro Devices
|
S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品(MCP)的512兆位2兆16位)的CMOS 1.8伏,只有同时写,突发模式闪存
|
Spansion Inc. Spansion, Inc.
|
S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品 Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
|
Spansion Inc. Spansion, Inc.
|
DS42553 AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
AM41DL32X4GT85IS AM41DL32X4GT85IT AM41DL32X4GB85IT |
SPECIALTY MEMORY CIRCUIT, PBGA73 Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No 堆叠式多芯片封装(MCP)闪存和SRAM Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Spansion, Inc. Advanced Micro Devices
|
SDA356JUF SDA276B SDA276C SDA276D SDA276E SDA276G |
600 V, 1 A fast and ultra fast rectifier assembly 100 V, 1.5 A bridge rectifier assembly 200 V, 1.5 A bridge rectifier assembly 400 V, 1.5 A bridge rectifier assembly 600 V, 1.5 A bridge rectifier assembly 1000 V, 1.5 A bridge rectifier assembly 1500 V, 1.5 A bridge rectifier assembly 800 V, 1 A fast and ultra fast rectifier assembly 1200 V, 1 A fast and ultra fast rectifier assembly 400 V, 1 A fast and ultra fast rectifier assembly
|
Solid State Devices Inc
|
A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAMA82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位4Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行
|
AMIC Technology, Corp. AMIC Technology Corporation
|
S71GL032A40BFI0B2 S71GL064A80BAI0B3 S71GL064A80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM SPECIALTY MEMORY CIRCUIT, PBGA56 DIODE ZENER 200MW 5.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56 DIODE ZENER 200MW 9.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56 Stacked Multi-Chip Product (MCP) Flash Memory and RAM 堆叠式多芯片产品(MCP)的闪存和RAM DIODE ZENER 200MW 4.7V 1005 INDUCTOR POWER 3.3UH 5.4A SMD INDUCTOR,TOROID,HORIZONTAL, 22.0 uH,7.0 IDC,0.015 OHM,
|
Spansion, Inc. Spansion Inc.
|