PART |
Description |
Maker |
V827432K24S |
2.5 VOLT 32M x 72 HIGH PERFORMANCE UNBUFFERED ECC DDR SDRAM MODULE
|
MOSEL[Mosel Vitelic, Corp]
|
AT45DB321B-RI AT45DB321B-TI AT45DB321B-RC AT45DB32 |
CABLE ASSEMBLY; N MALE TO N MALE; 50 OHM, RG178B/U COAX 32M X 1 FLASH 2.7V PROM, PBGA44 32-megabit 2.7-volt Only DataFlash 32兆位2.7伏只的DataFlash 32-megabit 2.7-volt Only DataFlash 32M X 1 FLASH 2.7V PROM, PDSO28
|
Atmel Corp. Atmel, Corp.
|
KMM372V3280BK3 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块)
|
Samsung Semiconductor Co., Ltd.
|
KMM372F3200BK3 |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块)
|
Samsung Semiconductor Co., Ltd.
|
V54C3128804VS V54C3128404VS V54C3128804VT |
128Mbit SDRAM 3.3 VOLT/ TSOP II / SOC PACKAGE 8M X 16/ 16M X 8/ 32M X 4 128Mbit SDRAM 3.3 VOLT, TSOP II / SOC PACKAGE 8M X 16, 16M X 8, 32M X 4 128Mbit SDRAM.3伏,第二的TSOP / SOC的包米1616米x 82 × 4
|
Mosel Vitelic Corp Mosel Vitelic, Corp.
|
AT45DB321D-TU AT45DB321D-CNU AT45DB321D-MU AT45DB3 |
32-megabit 2.7-volt DataFlash 32M X 1 FLASH 2.7V PROM, DSO8
|
Atmel Corp. Atmel, Corp.
|
V54C3256 V54C3256804VS V54C3256404VS V54C3256404VT |
256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4 256Mbit SDRAM 3.3 VOLT/ TSOP II / SOC BGA / WBGA PACKAGE 16M X 16/ 32M X 8/ 64M X 4
|
Mosel Vitelic, Corp. Mosel Vitelic Corp
|
28F320C3 |
3 Volt Advanced Boot Block Flash Memory(3 V 高级快速引导块闪速存储器) 32M X 8 FLASH 3V PROM
|
Intel, Corp.
|
TC58NS256ADC |
256-MBIT (32M x 8 BITS) CMOS NAND E PROM (32M BYTE SmartMedia)
|
TOSHIBA
|
M372F3200DJ3-C |
32M x 72 DRAM DIMM with ECC Using 16Mx4, 4K & 8K Refresh, 3.3V 32M × 72配置,带ECC DRAM的内存使6Mx4K
|
Samsung Semiconductor Co., Ltd.
|
HYS64V32300GU HYS72V32300GU |
3.3 V 32M × 64-Bit SDRAM Module(3.3 V 32M × 64同步动态RAM模块) 3.3 V 32M × 72-Bit SDRAM Module(3.3 V 32M × 72同步动态RAM模块)
|
SIEMENS AG
|
PCNET-ISAII |
How to Perform Plug and Play Initiation Key with PCnet-ISA II 100KB (PDF) 如何与PCnet -二执行的ISA即插即用启动密钥100的(PDF格式
|
Future Technology Devices International, Ltd.
|