| PART |
Description |
Maker |
| TO263 |
Package Outline Drawing Transistor Outline 封装外形图晶体管外形
|
Electronic Theatre Controls, Inc.
ETC
List of Unclassifed Manufacturers
|
| HA12133MP |
PRE, REC, eguallzer IC for R-DAT
PRE,REC,EQUALLZER IC FOR R-DAT
|
Hitachi Semiconductor
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| TSOT23-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X3-16 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT23-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| HTSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
