| PART |
Description |
Maker |
| NP352-04808 NP352-04811 NP352-04813 NP352-1849-35 |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| ETCSP |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
|
Amkor Technology, Inc.
|
| CHC-CD0865A-01-10R0F CHC-CD0865A-01-10R0G CHC-CD08 |
Ceramic Ball Grid Termination Arrays
|
IRC - a TT electronics Company.
|
| CB0565A CB0565B |
Ceramic Ball Grid Termination Arrays
|
TT Electronics.
|
| YPKG-C7CG-A7A2DC |
CCGA1272, 37.5 MM X 37.5 MM, 1.0 MM PITCH, 1272 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
| 1565360-9 1565359 1565359-1 1565359-3 1565359-5 15 |
ON TAPING 0.5MM PITCH FINE MATE CONN. TAB ASSEMBLY
|
Tyco Electronics
|
| DF38-32P-03SD |
0.3 mm Pitch, 1.5 mm Mated Height, Board- to-Fine Coaxial Cable Connectors
|
List of Unclassifed Man...
|
| ECG2364 ECG2370 ECG2365 |
FAN AC 80X25 115/220V BALL, 18cfm
FAN AC 80X25 220V BALL, 25cfm
FAN AC 80X25 115/220V BALL, 13cfm 晶体管|晶体管|叩| 800V的五（巴西）总裁| 12A条一（c）|47VAR
|
EPCOS AG
|
| 24-5.02-030-002-829 24-5.02-034-003-829 24-5.02-02 |
Fine Pitch SMT Board to Board Connectors
|
AVX Corporation
|
| DF21-20P-0.6SD DF21-20P-0.6SD-GND DF21-20S-0.6V DF |
CAP 0.1UF 100V 80-20% Z5U RAD.20 .20X.20 BULK ROHS-LEAD 0.6毫米间距板对细同轴电缆连接器
0.6mm Pitch Board-to-Fine-Coaxial Cable Connectors 0.6毫米间距板对细同轴电缆连接器
|
HIROSE ELECTRIC Co., Ltd.
Hirose Electric USA, INC.
HIROSE[Hirose Electric]
|
| AMG8852 AMG8851 AMG8831 AMG8832 |
Infrared Array Sensor Grid-EYE
|
Panasonic Semiconductor
|
