| PART |
Description |
Maker |
| MOC |
Applications: Wired Network, Automotive, Mobile Communication, WiMAX, WLAN, Mobile
|
MERITEK ELECTRONICS COR...
|
| HYB18M1G320BF-7.5 |
DRAMs for Mobile Applications 1-Gbit x32 DDR Mobile-RAM
|
Qimonda AG
|
| HYB18M512160BFX HYB18M512160BFX-7.5 |
DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM
|
Qimonda AG
|
| DVS-355-ZU25E DVS-355-MU25E DVS-355-SU25E DVS-355M |
Embedded/Mobile Digital Video Platform with Intel Core Duo Mobile Processor
|
Advantech Co., Ltd.
|
| FLGA |
Fine Pitch Land Grid Array
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| CLGA |
Ceramic Land Grid Array Package
|
Amkor Technology, Inc.
|
| CX11250 CX20463 SMARTHSF CX20437 |
Smart HSF mobile modem
SmartHSF Mobile Modem
Host-Processed, V.90/K56flex Modem Device Set with CX11250 Host Side Device, CX20463 SmartDAA, and Optional CX20437 Voice Codec for PCI Bus/Mini PCI-Based Mobile Applications
|
List of Unclassifed Manufacturers
Conexant
Electronic Theatre Controls, Inc.
|
| LPF7045T-1R5N-C |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| LPF2005T-4R7M LPF2005T-3R3M |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| LPN1054T-151K |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
| LPF3015T-330M LPF3015T-100M LPF3015T-150M LPF3015T |
Shape & Dimensions / Recommended Solder Land Pattern
|
ABCO ELECTRONICS CO.LTD
|
