| PART |
Description |
Maker |
| 21-0136F |
PACKAGE OUTLINE 1216L THIN QFN 3x3x0.8mm
|
MAXIM - Dallas Semiconductor
|
| FPT-20P-M04 |
THIN SHRINK SMALL OUTLINE PACKAGE
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| 21-0140 |
PACKAGE OUTLINE, 16,20,28,32,40L THIN QFN, 5*5*0.75MM
|
Maxim Integrated Products
|
| RMKM-S |
Small Outline Resistor Networks, Ultra Film, Thin Film Technology
|
Vishay
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| PL00130-WCG25-14 |
SMD LED 0603 Package Top View
Flat lens thin package 1.6 x 0.8 x 0.8mm
|
P-tec Corporation
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| FCRN303 FCRN3031003FA |
Percision thin film resistor CSP
0805 PRECISION THIN FILM RESISTOR CSP (CHIP SCALE PACKAGE)
|
CALMIRCO[California Micro Devices Corp]
|
| SSOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|
