| PART |
Description |
Maker |
| KM68512A KM68512AL KM68512ALI KM68512ALI-L KM68512 |
2.7 V to 5.5 V, <100 µA, 8-Bit nanoDAC® D/A Converter with I2C Compatible Interface, Tiny SC70 Package; Package: SC70; No of Pins: 6; Temperature Range: Industrial
LJT 22C 22#22D PIN RECP
64Kx8 bit Low Power CMOS Static RAM
|
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
|
| ADM809-5LARTZ-RL7 ADM809-5LAKSZ-RL7 ADM809-5SAKS-R |
Microprocessor Supervisory Circuit in 3-Lead SOT-23 & SC70, Active-Low Push-Pull Output; Package: SC70; No of Pins: 3; Temperature Range: Industrial 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3
|
Analog Devices, Inc.
ANALOG DEVICES INC
|
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| SOT-89-3L |
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
SOT-89-3L PACKAGE OUTLINE DIMENSIONS
|
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| WDFN2X2-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP15X15-163 |
Package Outline
|
Global Mixed-mode Techn...
|
