| PART |
Description |
Maker |
| 48TQFP |
48 PIN TQFP/TQN PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| 21-0110 |
PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
|
Dallas Semiconducotr
DALLAS[Dallas Semiconductor]
|
| MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2317GN-HF |
4.2 A, 20 V, 0.052 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| SOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
| PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
| TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X3-16 |
Package Outline
|
Global Mixed-mode Techn...
|
