PART |
Description |
Maker |
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
MSA20 |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20 20 -铅收缩小型封装(SSOP封装),EIAJ型二.3mm宽包MSA20
|
Fairchild Semiconductor, Corp. Fairchild Semiconductor Corporation
|
SOT223 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT109-1 |
Package outline
|
NXP Semiconductors Philips Semiconductors
|
LQFP44 |
Package outline
|
Philips
|
PG-LQFP-64-12 PG-LQFP-64-19 PG-LQFP-64-22 PG-LQFP- |
Package Outline
|
Infineon
|
SOT23-3 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
SOP-8-EP |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-8 |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-20 |
Package Outline
|
Global Mixed-mode Techn...
|