| PART |
Description |
Maker |
| STW9B12C |
Thermally Enhanced Package Design
|
Seoul Semiconductor
|
| GS8000 GS8000-063 GS8000-03X GS8000-095 GS8000-126 |
Increase package design flexibility while maintaining electrical integrity
|
List of Unclassifed Manufacturers
|
| HVD355B |
Super small Flat Lead Package (SFP) is suitable for surface mount design
|
TY Semiconductor Co., Ltd
|
| AEC-6913-A1M-1010 AEC-6913-A2M-1010 |
Design for Industrial Automation, Reliable Design: RS-422/485 10x. DIO
|
AAEON Technology
|
| AD688AQ AD688 |
High Precision 0 V Reference
ECONOLINE: REC2.2-S_DR/H1 - 2.2W DIP Package- 1kVDC Isolation- Regulated Output- UL94V-0 Package Material- Continuous Short Circiut Protection- Internal SMD design- 100% Burned In- Efficiency to 75%
High Precision - 10 V Reference
|
Analog Devices, Inc.
ANALOG DEVICES INC
|
| HSU277 |
Low forward resistance Ultra small Resin Package (URP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
| SDX05D4-A SDX05G2-A SDX15A2-A SDX15D4-A SDX15G2-A |
Precision compensated pressure sensors in DIP package
|
Sensortechnics GmbH
|
| AD7142ACPZ-1500RL7 |
Programmable Controller for Capacitance Touch Sensors; Package: LFCSP (5x5mm CP-32-2); No of Pins: 32; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
| AD7705BRU AD7706 EVAL-AD7706EB EVAL-AD7705EB AD770 |
3 V/5 V, 1 mW 2-/3-Channel 16-Bit, Sigma-Delta ADCs 3 5伏，1毫瓦2-/3-Channel 16位Δ模数转换
Precision Zero-Drift Operational Amplifier with Internal Capacitors; Package: SO; No of Pins: 8; Temperature Range: 0°C to 70°C 3 5毫瓦2-/3-Channel 16位Δ模数转换器（264.12十一
ECONOLINE: REC2.2-S_DR/H1 - 2.2W DIP Package- 1kVDC Isolation- Regulated Output- UL94V-0 Package Material- Continuous Short Circiut Protection- Internal SMD design- 100% Burned In- Efficiency to 75%
3 V/5 V/ 1 mW 2-/3-Channel 16-Bit/ Sigma-Delta ADCs
|
http://
Analog Devices, Inc.
|
| UPD65530 UPD65510 UPD65565 UPD65567 UPD65507 |
ANACONDA LT TRANSCEIVER
CMOS Gate Array.Embedded Array Ver.2.0 for Package | Design Manual[05/2003] CMOS门阵列Array.Embedded的包版本2.0 |设计手册[05/2003]
|
TE Connectivity, Ltd.
Vishay Intertechnology, Inc.
|
