PART |
Description |
Maker |
MX23L1610PC-12G MX23L1610TC-12G |
3.3 Volt 16-Mbit (2M x 8 / 1M x 16) Mask ROM 1M X 16 MASK PROM, 120 ns, PDIP42 Resistor Wirewound 25.5 OHM 1% 0.75W 20PPM AXIAL Thru-Hole Bulk 1M X 16 MASK PROM, 120 ns, PDSO48
|
Macronix International Co., Ltd.
|
MX23L6414XI-12G |
64M-BIT MASK ROM 4M X 16 MASK PROM, 120 ns, PBGA64
|
Macronix International Co., Ltd.
|
EB632 |
Functional Differences Between MSC8101 (Mask 2K42A) and MSC8103 (Mask 2K87M)
|
飞思卡尔半导体(中国)有限公司
|
MX23C8100 MX23C8100MC-10 MX23C8100MC-12 MX23C8100M |
8M-BIT MASK ROM (8/16 BIT OUTPUT) 512K X 16 MASK PROM, 150 ns, PDSO44
|
Macronix International Co., Ltd. MCNIX[Macronix International]
|
HT23C010 23C010 |
From old datasheet system CMOS 128K x 8-Bit Mask ROM(CMOS 128K x 8位掩模式ROM) 的CMOS 128K的8位掩模ROM28K的的CMOS × 8位掩模式光盘 CMOS 128K 8-Bit Mask ROM CMOS 128K? 8-Bit Mask ROM CMOS 128K′ 8-Bit Mask ROM
|
Holtek Semiconductor, Inc. HOLTEK[Holtek Semiconductor Inc]
|
MX23L8103TC-70 MX23L8103TC-90 |
8M-BIT MASK ROM 512K X 16 MASK PROM, 70 ns, PDSO48 8M-BIT MASK ROM 512K X 16 MASK PROM, 90 ns, PDSO48
|
Fujitsu, Ltd. Macronix International Co., Ltd.
|
UPD703100AGJ-33-UEN UPD703100GJ-33-UEN UPD703101AG |
ROM-less version; Internal RAM: 4K bytes Mask ROM version; Mask ROM: 96K bytes; Internal RAM: 4K bytes Mask ROM version; Mask ROM: 128K bytes; Internal RAM: 4K bytes Flash version; Internal flash: 128K bytes; Internal RAM: 4K bytes 32-bit RISC microcontroller (V850E/MS2:ROMless,Internal RAM: 4 KB)
|
NEC
|
MX23C1024 23C1024 MX23C1024PC-12 MX23C1024QC-20 MX |
1M-BIT [64K x 16] CMOS MASK ROM From old datasheet system 1m-BIT [64KX16] CMOS MASK ROM
|
MCNIX[Macronix International] Macronix 旺宏
|
A23W8308 A23W8308L A23W8308H A23W8308M |
262,144 X 8 BIT CMOS MASK ROM 120ns/5.0V; 150ns/3.0V 262,144 x 8bit CMOS MASK ROM
|
AMIC Technology
|
K3P6C1000B-TC15 K3P6C1000B-TC12 |
2M X 16 MASK PROM, 150 ns, PDSO44 0.400 INCH, TSOP2-44 2M X 16 MASK PROM, 120 ns, PDSO44 0.400 INCH, TSOP2-44
|
NEC, Corp.
|
SNR008 |
8M-bit Mask ROM
|
SONIX[SONiX Technology Company]
|