| PART |
Description |
Maker |
| 19459 19459-3 |
THERMAL INTERFACE PAD (VI-200)
THERMAL INTERFACE PAD, (VI-200)
|
VICOR[Vicor Corporation]
|
| 19458 19458-3 |
THERMAL INTERFACE PAD (VI-J00)
THERMAL INTERFACE PAD, (VI-J00)
|
VICOR[Vicor Corporation]
|
| H48-6G |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| TMP-001 TMP-002 TMP-003 TMP-005 TMP-007 |
TMP Thermal Pad Accessory
|
http://
Crane Aerospace & Electronics.
|
| AND8044 AND8044_D AND8044/D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ONSEMI
ON Semiconductor
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| MON35W42 |
Hardware Monitoring IC with Thermal Diode Interface
|
Standard Microsystems
|
| 12.000MQ22030-101860 12.000MQ2030-101860 MQ2 MQ203 |
7 x 5mm SMD, 4 pad or 2 pad
|
EUROQUARTZ limited
|
| TIC-4000 |
High Performance Thermal Interface Compound for Copper-Based Heat Sinks
|
List of Unclassifed Man...
|
| AD5405YCPZ-REEL7 |
Dual 12-Bit , High Bandwidth, Multiplying DAC with 4 Quadrant Resistors and Parallel Interface; Package: LFCSP (6x6mm w.4.1mm pad); No of Pins: 40; Temperature Range: Industrial
|
ANALOG DEVICES INC
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
| EMC1428 EMC1428-1-AP EMC1428-6-AP |
1∑C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
