| PART |
Description |
Maker |
| 93LC56A/SM 93LC56A/P 93LC56B/ST 93LC56A/ST 93LC56A |
D52 - BANDING BACKSHELL STRT MIL
CONNECTOR ACCESSORY
2K 2.5V Microwave Serial EEPROM
DIE SET 95MMSQ
|
Microchip Technology Inc.
|
| 6A04 LT6A07 6A01 6A02 6A05 6A06 6A07 LT6A01 LT6A02 |
CONNECTOR ACCESSORY 6 A, 50 V, SILICON, RECTIFIER DIODE
D52 - BANDING BACKSHELL STRT MIL
6.0A RECTIFIER
|
Diodes, Inc.
Diodes Inc.
DIODES[Diodes Incorporated]
|
| TC4001 TC4001BF TC4001BFN TC4001BFT TC4001BP E4000 |
D52 - BACKSHELL ENVIRON EMI-RFI 90 DEG M
QUAD 2 INPUT NOR GATE
From old datasheet system
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| 557S184M |
EMI/RFI Banding Backshell Assembly
|
Glenair, Inc.
|
| 557T386M 557E386M 557B386M 557S386M |
EMI/RFI Banding Backshell Assembly
|
Glenair, Inc.
|
| 557E319M 557B319M |
EMI/RFI Banding Backshell Assembly
|
Glenair, Inc.
|
| 6A10 P600K 6A05 P600G |
D52 - BACKSHELL ENVIRON EMI-RFI 90 DEG M
CONNECTOR ACCESSORY
TECHNICAL SPECIFICATIONS OF SILICON RECTIFIER 技术规格一般整
|
DC Components Co., Ltd.
|
| 557-107M2 |
D-Subminiature Light-Weight Solid Banding Backshell
|
Glenair, Inc.
|
| 507-142M21BB 507-142M21EB 507-142M21HB 507-142M67B |
EMI/RFI Dual Entry Banding Backshell
|
Glenair, Inc.
|
| 557E283M 557T283M 557S283M |
D-Subminiature Lightweight Solid EMI/RFI Banding Backshell
|
Glenair, Inc.
|
| 557S091N 557S091ZN 557S091B 557S091J 557S091LF 557 |
EMI/RFI Banding Backshell Assembly for MIL-C-24308 Connectors
|
Glenair, Inc.
|
| 687-169 |
EMI/RFI Banding Backshell Assembly for MIL-C-24308 Connectors
|
Glenair, Inc.
|
