PART |
Description |
Maker |
M6MGT331S4BKT M6MGB331S4BKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
M6MGT647M17AKT |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
|
Renesas
|
AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc. Spansion, Inc.
|
AM49DL320BGB701T AM49DL320BGT701T AM49DL320BGT701S |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位个M × 8 2米x 16位).0伏的CMOS只,同时 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位4个M × 8 2米x 16位).0伏的CMOS只,同时 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion, Inc. Spansion Inc. ADVANCED MICRO DEVICES INC Advanced Micro Devices, Inc.
|
MB84VD21181EM-70PBS MB84VD21183EM-70PBS MB84VD2118 |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS Stacked MCP (Multi-Chip Package) FLASH MEMORY & SRAM CMOS SPECIALTY MEMORY CIRCUIT, PBGA56
|
Spansion Inc. Spansion, Inc.
|
S75PL127NBFJFWGZ0 S75PL127NBGJAWGZ2 S75PL256NBFJAW |
Stacked Multi-Chip Product (MCP)
|
SPANSION[SPANSION]
|
S71GL512NB0 S71GL128NB0 S71GL256NB0 |
Stacked Multi-chip Product (MCP)
|
SPANSION[SPANSION]
|
S71AL016D02 S71AL016D02-T7 S71AL016D02BFWBF0 S71AL |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM
|
SPANSION[SPANSION]
|
AM49DL3208G |
Stacked Multi-Chip Package (MCP) Flash Memory and pSRAM
|
Advanced Micro Devices
|