| PART |
Description |
Maker |
| GSM31P256KB-I66 GSM31P512KB-I66 |
x64 Interleaved Burst Mode SRAM Module
256KB Secondary Cache Module Designed For Use With Intel Pen-tium CPU based system(用于英特尔奔腾处理器系统56KB二级高速缓冲存储器)
512KB Secondary Cache Module Designed For Use With Intel Pen-tium CPU based system(用于英特尔奔腾处理器系统12KB二级高速缓冲存储器)
|
GSI Technology
|
| LDECA2100JA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 0.01 uF, 5%, 50 V, 40 VAC, 125C, 1206, 1.1mm
|
Kemet Corporation
|
| FCN3022A394K-X FCN2416A104K-D1 FCN2820A224K-Z FCN2 |
Stable Stacked Metallized Film (PEN) Chips for Reflow Soldering
Stable Stacked Metallized Film (PEN) Chips for Reflow Soldering
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
List of Unclassifed Man...
|
| LDEEA1390KA0N00 |
Film, Metallized PEN Stacked, Commercial Grade, LDE, 3900 pF, 10%, 100 V, 63 V, 125C, 1206, 1.1mm
|
Kemet Corporation
|
| LDECA1180KA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 1800 pF, 10%, 50 V, 40 VAC, 125C, 1206, 1.1mm
|
Kemet Corporation
|
| LDECA1390KA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 3900 pF, 10%, 50 V, 40 VAC, 125C, 1206, 1.1mm
|
Kemet Corporation
|
| LDECA1560JA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 5600 pF, 5%, 50 V, 40 VAC, 125C, 1206, 1.1mm
|
Kemet Corporation
|
| LDECB2470MA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 0.047 uF, 20%, 50 V, 40 VAC, 125C, 1210, 2.1mm
|
Kemet Corporation
|
| FCN2825G563J-Y FCN1206A332J-H3 FCN2416G153J-D3 FCN |
Stable Stacked Metallized Film (PEN) Chips for Reflow Soldering
|
Cornell Dubilier Electr...
|
| LDECA1470KA0N00 |
Film, Metallized PEN Stacked, Commercial Grade, LDE, 4700 pF, 10%, 50 V, 40 V, 125C, 1206, 1.1mm
|
Kemet Corporation
|
| LDEIE3220KA0N00 |
Film, Metallized PEN Stacked, Commercial Grade, LDE, 0.22 uF, 10%, 250 V, 120 V, 125C, 2824, 5.2mm
|
Kemet Corporation
|
|
