PART |
Description |
Maker |
PHE840KR7470MR03R06L2 PHE840JR7470MR03R06L2 PHE840 |
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 4.7 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT EMI suppressor, class X2, metallized polypropylene
|
KEMET, Corp. Kemet Corporation
|
PHE840ER7470MR03R06L2 PHE840EB6120MB10R17 PHE840EA |
CAPACITOR, METALLIZED FILM, POLYPROPYLENE, 4.7 uF, THROUGH HOLE MOUNT RADIAL LEADED, ROHS COMPLIANT EMI suppressor, class X2, metallized polypropylene
|
KEMET, Corp. Kemet Corporation
|
F861AK823M310C F861AL823M310C F861BC104M310C F861A |
Metallized Polypropylene Film, Class X2, 310 VAC Metallized Polypropylene Film, Class X2, 310 VAC
|
Kemet Corporation
|
P271CE102M250A |
PME271Y Series Metallized Impregnated Paper, Class Y2, 250 VAC
|
Kemet Corporation
|
1MC04004 1MC0400412 1MC04-004-03 1MC04-004-05 1MC0 |
Blank ceramics (not metallized) Metallized (Au plating)
|
RMT Ltd.
|
1MDL06-024-05T 1MDL06-024-03T 1MDL06-024-07T |
Blank ceramics (not metallized) Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
2MX06-067-0816 2MX06-067-0510 2MX06067 |
Blank ceramics (not metallized) Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
80960MC |
EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT AND MEMORY MANAGEMENT UNIT
|
INTEL[Intel Corporation]
|
4MD06-160-15 4MD06-160-12 4MD06-160-10 4MD06-160-0 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|
1MD04-010-12-1 1MD04-010-15-1 1MD04-010-10-1 1MD04 |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
RMT Ltd.
|