| PART |
Description |
Maker |
| HY67V161610D HY67V161610DTC HY67V161610DTC-10 HY67 |
2 Banks x 512K x 16 Bit Synchronous DRAM
|
Hynix Semiconductor
|
| M12L64322A M12L64322A-6T M12L64322A-7T |
512K x 32 Bit x 4 Banks Synchronous DRAM
|
Elite Semiconductor Memory Technology Inc.
ETC
|
| A43L1632V-6 A43L1632V-7 A43L1632 |
512K X 32 Bit X 4 Banks Synchronous DRAM
|
AMICC[AMIC Technology]
|
| A43L0616BV-7F A43L0616BV-6F A43L0616BV-7UF |
512K X 16 Bit X 2 Banks Synchronous DRAM 12k × 16位2银行同步DRAM
|
AMIC Technology Corporation
AMIC Technology, Corp.
|
| HY57V161610ETP-I HY57V161610ETP-5I |
2 banks x 512K x 16 bit synchronous DRAM, LVTTL, 200MHz
|
HYNIX[Hynix Semiconductor]
|
| IC42S16101 IC42S16101-5BG IC42S16101-5BIG IC42S161 |
512K x 16 Bit x 2 Banks (16-MBIT) SDRAM
DYNAMIC RAM
|
ICSI[Integrated Circuit Solution Inc]
|
| N16D1633LPAZ2-10I N16D1633LPAZ2-75I N16D1633LPAC2- |
512K × 16 Bits × 2 Banks Low Power Synchronous DRAM
|
NanoAmp Solutions, Inc.
|
| N16D1618LPAZ2-75I N16D1618LPA N16D1618LPAC2-10I N1 |
512K 】 16 Bits 】 2 Banks Low Power Synchronous DRAM
|
NANOAMP[NanoAmp Solutions, Inc.]
|
| K4R881869 K4R881869M-NCK8 K4R881869M-NBCCG6 |
288Mbit RDRAM 512K x 18 bit x 2*16 Dependent Banks Direct RDRAMTM
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| 79LV0408XPFK-20 79LV0408XPFI-20 79LV0408XPFH-20 79 |
Low Voltage 4 Megabit (512k x 8-bit) EEPROM 512K X 8 EEPROM 3V, 250 ns, PDFP40
Low Voltage 4 Megabit (512k x 8-bit) EEPROM 512K X 8 EEPROM 3V, 200 ns, PDFP40
IC LOGIC 3245 OCTAL FET BUS SWITCH -40 85C QSOP-20 55/TUBE 512K X 8 EEPROM 3V, 250 ns, PDFP40
|
Maxwell Technologies, Inc
|
| W986432AH W986432AHA1 |
512K x 4 BANKS x 32 BITS SDRAM
512K x 4 BANKS x 32 BITS SDRAM
From old datasheet system
|
Winbond Electronics
WINBOND[Winbond]
|
