PART |
Description |
Maker |
HSM88ASR |
MPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
HSB88WA |
CMPAK package is suitable for high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
LTV847 LTV817 |
HIgh Density Mounting Type Photocoupler
|
Lite-On Technology Corporation
|
PC849 |
High Density Mounting Type Photocoupler
|
Sharp Electrionic Compo...
|
PC-815 |
High Sensitivity, High Density Mounting Type Photocoupler
|
N/A
|
HCPL-817-36DE HCPL-817-36CE HCPL-817-36AE HCPL-817 |
Phototransistor Optocoupler High Density Mounting Type
|
AVAGO TECHNOLOGIES LIMITED AVAGO TECHNOLOGIES LIMI...
|
HPCL-817 HPCL817 |
Phototransistor Optocoupler High Density Mounting Type
|
Agilent Technologies
|
ISP321-1-88XSM |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM List of Unclassifed Manufacturers
|
TLP621-2 TLP621-4 TLP621 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
IS181 |
HIGH DENSITY MOUNTING PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
ISOCOM COMPONENTS
|
IS354 |
HIGH DENSITY MOUNTING AC INPUT, PHOTOTRANSISTOR OPTICALLY COUPLED ISOLATORS
|
Electronic Theatre Controls, Inc.
|