| PART |
Description |
Maker |
| XC1700E XC1701LPC20C XC1701LPC20I XC1701LPD8C XC17 |
Configuration PROM.
XC1700E and XC1700L Series Configuration PROMs
IC,EPROM,128KX1,CMOS,DIP,8PIN,PLASTIC
From old datasheet system
Configuration PROMs 4M X 1 CONFIGURATION MEMORY, PQFP44
Configuration PROMs 256K X 1 CONFIGURATION MEMORY, PQCC20
|
Xilinx Inc
XILINX[Xilinx, Inc]
Xilinx, Inc.
|
| XQ1701L-SERIES XQR1701L-SERIES XQ1701LCC44M XQR170 |
Cascadable for storing longer or multiple bitstreams
QPro configuration PROM. Radiation-hardened.
QPro configuration PROM. SMD number 5962-9951401NXB.
QPro configuration PROM. SMD number 5962-9951401QYA
QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR) 1M X 1 CONFIGURATION MEMORY, PDSO20
1M X 1 CONFIGURATION MEMORY, CQCC44
|
Xilinx, Inc.
XILINX INC
|
| TDA5225 |
Enhanced Sensitivity Multi-Channel Quad-Configuration Receiver
|
Infineon Technologies A...
|
| T10C T10C110 T10C140 T10C180 T10C220 T10C270 T10C8 |
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE3 Point Connector Block 5B. 3端配置，比赛在应用程序插件GDT中引脚配置，适合在科龙⑩3点连接器5B条
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE⑩ 3 Point Connector Block 5B.
3 Terminal configuration matches G.D.T. pin configuration For Plug in Applications fits in KRONE 3 Point Connector Block 5B.
3 Terminal configuration, matches G.D.T. pin configuration For Plug in Applications, fits in KRONE 3 Point Connector Block 5B.
SiBOD
|
Littelfuse, Inc.
LITTELFUSE[Littelfuse]
|
| T-31201 T-31202 |
Single Configuration / Dual Configuration
|
Rhombus Industries Inc.
|
| EPC2LI20 EPC1441PI8 EPC2 EPC8 |
Configuration Devices For SRAM-based Lut Devices, 440,800 1-bit Device With 5.0-V or 3.3-V Operation
Configuration Device Family
|
Altera Corporation
|
| XC18V00-SERIES-OF-IN-SYSTEM-PROGRAMMABLE XC18V256V |
XC18V00 Series of In-System Programmable Configuration PROMs
In-system programmable configuration PROM.
|
Xilinx
|
| IRFK6J150 IRFK6H150 IRFK6H350 IRFK6J350 IRFK6JC50 |
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION 隔震基电力六角巴基斯坦大会平行芯片配
Lsolated Base Power HEX-pak Assembly Half Bridge Configuration
100V SINGLE HEXFET Power MOSFET in a TO-240AA package
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| XC18V512 XC18V01 |
In-System Programmable Configuration PROMs(在系统可编程配置PROM)
In-System Programmable Configuration PROMs(?ㄧ郴缁??缂????疆PROM)
|
Xilinx, Inc.
|
| M28W320EBB85ZB1T M28W320EBT85N1T M28W320EBB85N1T M |
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 12.7 V; VZ min.: 11.4 V; VZ nom: 12 V
surface mount silicon Zener diodes
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 15.6 V; VZ min.: 13.8 V; VZ nom: 15 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 11.6 V; VZ min.: 10.4 V; VZ nom: 11 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 10.6 V; VZ min.: 9.4 V; VZ nom: 10 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 3.5 V; VZ min.: 3.1 V; VZ nom: 3.3 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 14.1 V; VZ min.: 12.4 V; VZ nom: 13 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 2.6 V; VZ min.: 2.2 V; VZ nom: 2.4 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 2.9 V; VZ min.: 2.5 V; VZ nom: 2.7 V
Voltage regulator double diodes - Configuration: dual c.a. ; IF max: 200 mA; Ptot: 350 mW; PZSM: 40 W; Tolerance /- %: appr. 5% ; VZ max.: 3.2 V; VZ min.: 2.8 V; VZ nom: 3 V
32 Mbit (2Mb x16, Boot Block) 3V Supply Flash Memory 32兆位（处理器x16插槽，引导块V电源快闪记忆
|
意法半导
STMicroelectronics N.V.
|
| EPC1064 EPC1 EPC1213 EPC1441 EPC1441XXX EPC1064PC8 |
Configuration devices for SRAM-based LUT devices, 440,800 1-bit device with 5.0-V or 3.3-V operation
Configuration devices for SRAM-based LUT devices, 65,536 1-bit device with 3.3-V operation
Configuration devices for SRAM-based LUT devices, 65,536 1-bit device with 5.0-V operation
Configuration devices for SRAM-based LUT devices, 212,942 1-bit device with 5.0-V operation
|
Altera Corporation
List of Unclassifed Manufacturers
Electronic Theatre Controls, Inc.
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