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330M2 ATMEL 102M000 VP5513 VP5513 SSU2N60B MBRD350 54019
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For die Found Datasheets File :: 45543    Search Time::1.391ms    
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    ZXMC3AM832

Zetex Semiconductors
Part No. ZXMC3AM832
OCR Text ...ring information 3mm x 2mm dual die mlp 1 2 3 4 5 678 3 x 2 dual mlp underside view pinout zxmc3am832 provisional issue d - july 2002 2 parameter symbol value unit junction to ambient (a)(f) r ja 83.3 c/w junction to ambient (b)(f) r ja...
Description N & P-channel MOSFET

File Size 309.20K  /  10 Page

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    SIPEX[Sipex Corporation]
Part No. SP4427UEB SP4427 SP4427CN SP4427CU SP4427CX SP4427NEB SP4427TR
OCR Text ...o SOIC package. For delivery in die form, please consult the factory. 6 VDD COIL 7 1 HON EN 8 Bit Counter Cosc Coil OSC H Bridge EL1 5 3 Losc 8 Lamp OSC VSS 2 EL2 4 Block Diagram SP4427DS/01 SP4427 Electroluminescent Lamp D...
Description Electroluminescent Lamp Driver Dual Oscillators with High Drive Capability

File Size 108.64K  /  9 Page

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    SIPEX[Sipex Corporation]
Part No. SP4425QCUEB SP4425Q SP4425QCU
OCR Text ...n SOIC package. For delivery in die form, please consult the factory. COSC VSS COIL D1 1 2 3 4 SP4425Q 8 7 6 5 HON VDD EL1 EL2 SP4425Q Block Diagram SP4425QDS/12 SP4425Q Electroluminescent Lamp Driver (c) Copyright 1998 Sipe...
Description Electroluminescent Lamp Driver for Low Noise Applications

File Size 207.53K  /  12 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TQHBT3
OCR Text ...nd high density capacitors keep die sizes small. MOCVD epitaxial processes are utilized to grow the active layers. A carbon-doped Base and InGaP Emitter are utilized for high RF performance consistent with high reliability. Designs utilizin...
Description InGaP HBT Foundry Service

File Size 116.93K  /  6 Page

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    POLYFET[Polyfet RF Devices]
Part No. SP201
OCR Text ... CAPACITANCE VS VOLTAGE S2A 1 die CAPACITANCE 13.50 6 5 12.50 Pout 4 11.50 10 Ciss 1dB compression = 4 watts 3 10.50 Coss 2 9.50 1 Gain Efficiency = 45% 1 8.50 Crss 0.1 0 5 10 0 0 0.2 0.4 0.6 0...
Description SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR

File Size 33.29K  /  2 Page

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    Vishay
Part No. SIHFZ46
OCR Text ...urrent limited by the package, (die current = 54 a). product summary v ds (v) 50 r ds(on) ( )v gs = 10 v 0.024 q g (max.) (nc) 66 q gs (nc) 21 q gd (nc) 25 configuration single n - c hannel m os fet g d s to-220 g d s a v aila ...
Description Power MOSFET

File Size 689.25K  /  8 Page

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    INFINEON[Infineon Technologies AG]
Part No. SP0002-04966 SIGC42T120CQ
OCR Text ...20CQ VCE 1200V ICn 25A die Size 6.59 x 6.49 mm2 Package sawn on foil Ordering Code SP0002-04966 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.po...
Description IGBT Chip in Fieldstop -technology

File Size 32.40K  /  4 Page

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    INFINEON[Infineon Technologies AG]
Part No. SP0000-83655 SIGC156T120R2CQ
OCR Text ...IGC156T120R2CQ VCE ICn die Size 12.59 X 12.59 mm2 Package sawn on foil Ordering Code SP0000-83655 1200V 100A MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat...
Description IGBT Chip in Fieldstop-technology

File Size 74.78K  /  4 Page

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For die Found Datasheets File :: 45543    Search Time::1.391ms    
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