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  81024 Datasheet PDF File

For 81024 Found Datasheets File :: 38+       Page :: | 1 | 2 | <3> | 4 |   

    GMS81008 GMS81016 GMS81024 GMS81032 GMS81004

HYNIX[Hynix Semiconductor]
Part No. GMS81008 GMS81016 GMS81024 GMS81032 GMS81004
Description 8-BIT SINGLE CHIP MICROCOMPUTERS

File Size 555.15K  /  101 Page

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Amphenol Communications Solutions

Part No. 95278-102-40LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 40 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Mosel Vitelic Corp
Part No. V62C5181024L-45WI V62C5181024L-55WI V62C5181024LL-45WI
Description 128K x 8 CMOS static RAM, 45ns, low power
128K x 8 CMOS static RAM, 55ns, low power
128K x 8 CMOS static RAM, 45ns, low low power

File Size 591.12K  /  11 Page

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Amphenol Communications Solutions

Part No. 95278-102-46LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Visual Communications Company, Inc.
RECOM Electronic GmbH
Part No. 8102401XA 8102403VA 8102408VA 8102401VA
Description x1 SRAM x1的SRAM

File Size 900.30K  /  27 Page

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Amphenol Communications Solutions

Part No. 65781-024LF
Description Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,48 Positions
Tech specs    

Official Product Page

    V62C5181024 V62C5181024L-35P V62C5181024L-35PI V62C5181024L-35T V62C5181024L-35TI V62C5181024L-35W V62C5181024L-35WI V62

MOSEL-VITELIC
Mosel Vitelic, Corp.
MOSEL[Mosel Vitelic, Corp]
Mosel Vitelic Corp
MOSEL[Mosel Vitelic Corp]
Part No. V62C5181024 V62C5181024L-35P V62C5181024L-35PI V62C5181024L-35T V62C5181024L-35TI V62C5181024L-35W V62C5181024L-35WI V62C5181024L-70P V62C5181024L-70PI V62C5181024L-70T V62C5181024L-70TI V62C5181024L-70W V62C5181024L-70WI V62C5181024LL-35PI V62C5181024LL-35T V62C5181024LL-35TI V62C5181024LL-35W V62C5181024LL-35WI V62C5181024LL-70PI V62C5181024LL-70T V62C5181024LL-70TI V62C5181024LL-70W V62C5181024LL-70WI V62C5181024LL-70P V62C5181024LL-35P
Description 128K X 8 STANDARD SRAM, 70 ns, PDIP32
128K x 8 Static RAM 128K的8静态RAM
ER 14C 14#16 PIN RECP BOX

File Size 59.69K  /  12 Page

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Amphenol Communications Solutions

Part No. 54122-810241600LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    HM3-6514-9 HM3-6514B-9 HM3-6514S-9 8102402VA 8102404VA 8102406VA HM-6514 HM1-6514B-9 FN2995 HM1-6514-9 HM1-6514S-9 HM4-6

Intersil, Corp.
IntersilCorporation
INTERSIL[Intersil Corporation]
Part No. HM3-6514-9 HM3-6514B-9 HM3-6514S-9 8102402VA 8102404VA 8102406VA HM-6514 HM1-6514B-9 FN2995 HM1-6514-9 HM1-6514S-9 HM4-6514-B 24502BVA
Description 1024 x 4 CMOS RAM 1K X 4 STANDARD SRAM, 120 ns, CDIP18
GE KIT: CAT5 VGA VIDEO 2CSPLITTER & REMOTE 1K X 4 STANDARD SRAM, 200 ns, CDIP18
RES THICK FILM 10M OHM 5.0W 5%
SEMTRON WALLPHONE PLATE
1024x4CMOSRAM
From old datasheet system

File Size 40.43K  /  7 Page

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Amphenol Communications Solutions

Part No. 54112-810241800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 24 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Hynix Semiconductor Inc.
Hynix Semiconductor, Inc.
Part No. HMS81004E HMS81016E HMS81020TL HMS81024E HMS81032E HMS81032TL
Description    HYNIX SEMICONDUCTOR 8-BIT SINGLE-CHIP MICROCONTROLLERS
HYNIX SEMICONDUCTOR 8-BIT SINGLE-CHIP MICROCONTROLLERS Hynix半导体公司的8位单芯片微控制器

File Size 669.00K  /  77 Page

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Amphenol Communications Solutions

Part No. 95278-102-42LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 42 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    K4S643232C-TC/L80 K4S643232C-TC/L10 K4S643232C-TC/L55 K4S643232C-TC/L60 K4S643232C-TC/L70 K4S643232C-TC10 K4S643232C-TC7

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S643232C-TC/L80 K4S643232C-TC/L10 K4S643232C-TC/L55 K4S643232C-TC/L60 K4S643232C-TC/L70 K4S643232C-TC10 K4S643232C-TC70 K4S643232C-TC55 K4S643232C-TC80 K4S643232C-TC60 K4S643232C-TL60 K4S643232C-TL70 V62C5181024LL-70P K4S643232C-TL10
Description ECONOLINE: RY & RX - Controllable Output- 1kVDC Isolation- No Heatsink Required- UL94V-0 Package Material- Toroidal Magnetics- No External Components- Fully Encapsulated- Efficiency to 70%
Dual Low-Noise Precision Rail-To-Rail Operational Amplifier 14-SOIC 200万32内存12k × 32 × 4银行同步DRAM LVTTL
Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 8-CDIP -55 to 125 200万32内存12k × 32 × 4银行同步DRAM LVTTL
ECONOLINE: RY & RX - Controllable Output- 1kVDC Isolation- No Heatsink Required- UL94V-0 Package Material- Toroidal Magnetics- No External Components- Fully Encapsulated- Efficiency to 70%
Replaced by TLC2201A : Advanced LinCMOS(TM) Low-Noise Precision Operational Amplifier 8-PDIP -40 to 85
Replaced by TLC2201A : Advanced LinCMOS(TM) Low-Noise Precision Operational Amplifier 8-SOIC -40 to 85
Dual Low-Noise Precision Rail-To-Rail Operational Amplifier 14-SOIC
Low Noise Precision Advanced LinCMOS(TM) Single Operational Amplifier 20-LCCC -55 to 125
2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL

File Size 1,165.47K  /  43 Page

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Amphenol Communications Solutions

Part No. 95278-102-44LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    HMS81024E HMS81008E HMS81032E HMS81032TL HMS81004E HMS81016E HMS81020TL

HYNIX[Hynix Semiconductor]
Part No. HMS81024E HMS81008E HMS81032E HMS81032TL HMS81004E HMS81016E HMS81020TL
Description HYNIX SEMICONDUCTOR 8-BIT SINGLE-CHIP MICROCONTROLLERS

File Size 651.98K  /  77 Page

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Amphenol Communications Solutions

Part No. 54122-810242200LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 24 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    K4S643232C-TL55 K4S643232C-TL70 K4S643232C-TC70 V62C5181024LL-70P K4S643232C K4S643232C-TC10 K4S643232C-TC55 K4S643232C-

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S643232C-TL55 K4S643232C-TL70 K4S643232C-TC70 V62C5181024LL-70P K4S643232C K4S643232C-TC10 K4S643232C-TC55 K4S643232C-TC60 K4S643232C-TC80 K4S643232C-TL10 K4S643232C-TL60 K4S643232C-TL80 K4S643232C-TC_L10 K4S643232C-TC_L55 K4S643232C-TC_L60 K4S643232C-TC_L70 K4S643232C-TC_L80 K4S643232C-TC/L10 K4S643232C-TC/L55 K4S643232C-TC/L60 K4S643232C-TC/L70 K4S643232C-TC/L80
Description 2M x 32 SDRAM 512K x 32bit x 4 Banks Synchronous DRAM LVTTL

File Size 1,151.85K  /  43 Page

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Amphenol Communications Solutions

Part No. 65781-024
Description Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,48 Positions
Tech specs    

Official Product Page

    EDI8F81024LP100BSC EDI8F81024C85BSC

KEMET Corporation
Part No. EDI8F81024LP100BSC EDI8F81024C85BSC
Description Dual Channel, High Speed, High Current Line Driver with 3-State; Temperature Range: -40°C to 85°C; Package: 8-SOIC
Dual Channel, High Speed, High Current Line Driver with 3-State; Temperature Range: -40&deg;C to 85&deg;C; Package: 8-PDIP x8的SRAM模块

File Size 127.10K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-102-48LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 48 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

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Part: 81001813-1
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Pack: DIP-48
Stock: 263
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