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Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
M5M5Y5636TG-25 M5M5Y5636TG-22
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| OCR Text |
...ect to change.
M5M5Y5636TG - 25,22,20
18874368-BIT(524288-WORD BY 36-BIT) NETWORK SRAM
DESCRIPTION
The M5M5Y5636TG is a family of 18...Bump M5M5Y5636TG 209(11X19) bump BGA Body Size 14mm X 22mm Bump Pitch 1mm
PART NAME TABLE
Part N... |
| Description |
18874368-BIT(524288-WORD BY 36-BIT) NETWORK SRAM
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| File Size |
239.49K /
28 Page |
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it Online |
Download Datasheet
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MAXIM INTEGRATED PRODUCTS INC
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| Part No. |
MAX13034EEBE
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| OCR Text |
.........660mw 16-pin tqfn (derate 25.0mw/?)...............................2000mw operating temperature range ...........................-40? t...bump temperature (soldering)........................................+235? lead temperature (solderin... |
| Description |
SPECIALTY INTERFACE CIRCUIT, PBGA16
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| File Size |
401.04K /
20 Page |
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it Online |
Download Datasheet |
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VISHAY INTERTECHNOLOGY INC
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| Part No. |
FCSP240LTR
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| OCR Text |
...non-repetitive surge current at 25 c i fsm 5 s sine or 3 s rect. pulse following any rated load condition and with rated v rrm applied 25...bump pad design) outline dimensions vishay high power products dimensions in millimeters notes (1... |
| Description |
1.5 A, 40 V, SILICON, RECTIFIER DIODE
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| File Size |
132.59K /
6 Page |
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it Online |
Download Datasheet |
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Price and Availability
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