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Aeroflex Circuit Technology
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Part No. |
5962D0053601QUA 5962D0053601TxA 5962D0053602TxA 5962D0053601TxC 5962D0053602QxA 5962D0053602TUC 5962D0053602QxC 5962D0053603QUA 5962D0053601TUA 5962D0053601Qxx 5962D0053601TUC 5962D0053601TUx 5962D0053602TUx 5962D0053602QUx 5962D0053602Txx 5962D0053602Qxx 5962D0053602QUA 5962D0053601QxA 5962D0053601Txx 5962D0053602QUC 5962D0053602TxC 5962D0053601QxC 5962D0053602TUA 5962D0053601QUx 5962D0053601QUC 5962D0053603QUx 5962D0053603QxA 5962D0053603Qxx 5962D0053603QxC 5962D0053603QUC UT9Q512-IWx UT9Q512-IWC UT9Q512-20ICC UT9Q512-20ICx UT9Q512-20IPC UT9Q512-20IWC UT9Q512-20UCC UT9Q512-20UCA UT9Q512-20UCx UT9Q512-20UWA UT9Q512-ICA UT9Q512-IPC UT9Q512-20ICA UT9Q512-20IWA UT9Q512-20IWx UT9Q512-20UPC UT9Q512-20UWC UT9Q512-20UWx UT9Q512-ICC UT9Q512-ICx UT9Q512-IWA UT9Q512-UCA 5962D0053603TxC 5962D0053604TxC 5962L0053601TxC 5962L0053602TxC 5962L0053603TxC 5962L0053604TxC 5962P0053601TxC 5962P0053602TxC 5962P0053603TxC 5962P0053604TxC 5962L0053601QUA 5962L0053601QUC 5962L0053601QUx 5962L0053601QxA 5962L0053601QxC 5962L0053601Qxx 5962L0053601TUA 5962L0053601TUC 5962L0053601TUx 5962L0053601Txx 5962L0053602QUA 5962L0053602QUC 5962L0053602QUx 5962L0053602QxA 5962L0053602QxC 5962L0053602TUA 5962L0053602
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Description |
512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option. 512k x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. 512k x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. 512k x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. 512k x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow. 512k x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. 512k x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. 512k x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)). 512k x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).
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File Size |
128.60K /
15 Page |
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Download Datasheet |
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Aeroflex Circuit Technology
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Part No. |
5962L9960701QUA 5962L9960701QUC 5962L9960701QUx 5962L9960701QxA 5962L9960701QxC 5962L9960701Qxx 5962L9960701TUA 5962L9960701TUC 5962L9960701TUx 5962L9960701TxA 5962L9960701TxC 5962L9960702QUA 5962L9960701Txx 5962L9960702QUC 5962L9960702QUx 5962L9960702QxA 5962L9960702QxC 5962L9960702Qxx 5962L9960702TUA 5962L9960702TUC 5962L9960702TUx 5962D9960703TxC 5962D9960701TxC 5962D9960702TxC 5962D9960704TxC 5962L9960702TxC 5962L9960703TxC 5962L9960704TxC 5962P9960701TxC 5962P9960702TxC 5962D9960701QUA 5962D9960701QUC 5962D9960701QUx 5962D9960701QxA 5962D9960701QxC 5962D9960701TUA 5962D9960701Qxx 5962D9960701TUC 5962D9960701TUx 5962P9960701TxA 5962D9960701TxA 5962D9960704TUA 5962D9960702TUA 5962P9960703TxC UT8Q512-UWx 5962D9960704TxA 5962D9960702Txx 5962D9960704Txx 5962L9960702Txx 5962P9960701TUA 5962P9960701TUx 5962P9960701TUC 5962D9960703TUC 5962L9960703TUC 5962L9960704TUC 5962P9960702TUC 5962P9960703TUC UT8Q512-20UWC UT8Q512-UWC 5962D9960703TUx 5962D9960704QxA 5962D9960704QxC 5962D9960704Qxx
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Description |
512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 5E4(50krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 5E4(50krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 5E4(50krad)(Si) 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 5E4(50krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 3E4(30krad)(Si) 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish gold. Total dose 3E4(30krad)(Si) 512k x 8 SRAM. 25ns access time, 3.3V operation. Lead finish factory option. Extended industrial temperature range flow. 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 25ns access time, 3.3V operation. Class T. Lead finish factory option. Total dose 3E4(30krad)(Si) 512k x 8 SRAM. 20ns access time, 3.3V operation. Lead finish gold. Extended industrial temperature range flow. 512k x 8 SRAM. 25ns access time, 3.3V operation. Lead finish gold. Extended industrial temperature range flow. 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish hot solder dipped. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish gold. Total dose 1E4(10krad)(Si) 512k x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 1E4(10krad)(Si)
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File Size |
127.88K /
15 Page |
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it Online |
Download Datasheet |
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ADVANCED MICRO DEVICES INC
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Part No. |
AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT-80DPI2 AM29LV800BT-80DWC2 AM29LV800BT-80DWI2 AM29LV800BT-80DGC2 AM29LV800BT-80DTI2 AM29LV800BT-80DPC2 AM29LV800BB-80DGI2 AM29LV800BB-80DPI2 AM29LV800BB-80DTI2 AM29LV800BB-80DWC2 AM29LV800BB-80DWI2 AM29LV800BB-80DPC2 AM29LV800BB-80DGC2 AM29LV800BB-80DTC2 AM29LV800BB-120DTC2 AM29LV800BT-90DPI2 AM29LV800BT-90DTI2 AM29LV800BT-90DWI2 AM29LV800BT-120DTI2 AM29LV800BB-120DTI2 AM29LV800BT-120DGI2 AM29LV800BT-120DTC2 AM29LV800BB-90DTI2 AM29LV800BB-90DGC2 AM29LV800BB-120DGC2 AM29LV800BT-120DPC2 AM29LV800BT-90DPC2 AM29LV800BT-120DWI2 AM29LV800BB-120DPC2 AM29LV800BB-90DPC2 AM29LV800BB-90DWI2
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Description |
25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD) 20ns, OTP, PLCC, COM TEMP(EPLD) 20ns, SOIC, IND TEMP(EPLD) 25NS, SOIC, COM TEMP(EPLD) 20ns,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD) 10MHZ, 8 DIP, COM TEMP(FPGA) 10MHZ, 20 PLCC, IND TEMP(FPGA) 10MHZ, 32 TQFP, COM TEMP(FPGA) 10MHZ, 44 PLCC, COM TEMP(FPGA) 30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA) 8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE) DIE SALE, 1.8V, 11 MIL(SERIAL EE) 8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE) 65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA) 10MHZ, 20 SOIC, IND TEMP(FPGA) 128K CONFIG MEM, 20 PLCC, COM(FPGA) EEPROM EEPROM 10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM 512k x 16 FLASH 3V PROM, 120 ns, UUC44 10MHZ, 8 LAP, 5K MOQ(FPGA) 10MHZ, 8 N-SOIC, COM TEMP(FPGA) 10MHZ, 20 PLCC, COM TEMP(FPGA) 512k x 16 FLASH 3V PROM, 80 ns, UUC44
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File Size |
127.66K /
11 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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