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Harwin PLC
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Part No. |
D2864-01 D2808-21 D2824-21 D2922-01 D2808-01 D2818-01 D2820-01 D2832-21
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Description |
2.54mm pitch dual row PC Tail IC Socket Assembly, gold clip tin/lead shell, 64-way DIP24, IC SOCKET 2.54mm pitch dual row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 8-way DIP48, IC SOCKET 2.54mm pitch dual row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 24-way DIP24, IC SOCKET 2.54mm pitch dual row PC Tail IC Socket Assembly, gold clip tin/lead shell, 22-way DIP22, IC SOCKET 2.54mm pitch dual row PC Tail IC Socket Assembly, gold clip tin/lead shell, 8-way DIP48, IC SOCKET 2.54mm pitch dual row PC Tail IC Socket Assembly, gold clip tin/lead shell, 18-way DIP18, IC SOCKET 2.54mm pitch dual row PC Tail IC Socket Assembly, gold clip tin/lead shell, 20-way DIP40, IC SOCKET 2.54mm pitch dual row PC Tail IC Socket Assembly, gold-flash clip tin/lead shell, 32-way DIP32, IC SOCKET
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File Size |
204.26K /
1 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0741620040 74162-0040 74162-1030
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Description |
2.54mm (.100) pitch C-Grid? Receptacle, Right Angle, Through Hole, dual row,Shrouded, Version B, High-Temperature, 30 Circuits, Tin (Sn) 2.54mm (.100) pitch C-Grid Receptacle, Right Angle, Through Hole, dual row, Shrouded MOLEX Connector
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File Size |
1,304.67K /
10 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
70280-0068 A-70280-0068 0010897562 010-89-7562
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Description |
2.54mm (.100) pitch C-Grid? Breakaway Header, dual row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100") pitch C-Grid庐 Breakaway Header, dual row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating 2.54mm (.100") pitch C-Grid垄莽 Breakaway Header, dual row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
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File Size |
421.87K /
4 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-2815 0879142815
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Description |
2.54mm (.100) pitch C-Grid? Header, Through Hole, dual row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid庐 Header, Through Hole, dual row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, dual row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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File Size |
3,777.37K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-3616 0879143616
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Description |
2.54mm (.100) pitch C-Grid? Header, Through Hole, dual row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid庐 Header, Through Hole, dual row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, dual row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.41K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-2216 0879142216
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Description |
2.54mm (.100) pitch C-Grid? Header, Through Hole, dual row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid庐 Header, Through Hole, dual row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, dual row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
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it Online |
Download Datasheet |
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Price and Availability
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