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  01580 Datasheet PDF File

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    A-70567-0343 15-80-1101 0015801101

Molex Electronics Ltd.
Part No. A-70567-0343 15-80-1101 0015801101
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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HUA FENG CIRCUIT





    A-70567-0344 15-80-1121 0015801121

Molex Electronics Ltd.
Part No. A-70567-0344 15-80-1121 0015801121
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    A-70567-0346 15-80-1161 0015801161

Molex Electronics Ltd.
Part No. A-70567-0346 15-80-1161 0015801161
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    A-70567-0348 15-80-1201 0015801201

Molex Electronics Ltd.
Part No. A-70567-0348 15-80-1201 0015801201
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    A-70567-0349 15-80-1221 0015801221

Molex Electronics Ltd.
Part No. A-70567-0349 15-80-1221 0015801221
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    ONSEMI[ON Semiconductor]
Part No. MC1015802 MC10158FN MC10158L MC10158P MC10158 MC10158-D
Description Quad 2-Input Multiplexer (Non-Inverting)

File Size 84.58K  /  4 Page

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    CD1206-S01575R CD1206-S01580R CD1206-S0175R CD1206-S0180R CD0805-S0180R CD0805-S01575R CD0805-S01580R CD0805-S0175R

BOURNS[Bourns Electronic Solutions]
Part No. CD1206-S01575R CD1206-S01580R CD1206-S0175R CD1206-S0180R CD0805-S0180R CD0805-S01575R CD0805-S01580R CD0805-S0175R
Description Switching Chip Diode Series

File Size 276.87K  /  6 Page

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    BOURNS[Bourns Electronic Solutions]
Part No. CD1005-S0180R CD1005-S0175R CD1005-S01575R CD1005-S01580R CD0603-S0180R CD0603-S01575R CD0603-S01580R CD0603-S0175R
Description Switching Chip Diode Series

File Size 216.77K  /  6 Page

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    15-80-0121 A-70567-0004 0015800121 705670004

Molex Electronics Ltd.
Part No. 15-80-0121 A-70567-0004 0015800121 705670004
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.42K  /  7 Page

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    15-80-0081 A-70567-0002 0015800081 705670002

Molex Electronics Ltd.
Part No. 15-80-0081 A-70567-0002 0015800081 705670002
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.39K  /  7 Page

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