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    ATS014014004-SF-3C

Advanced Thermal Solutions, Inc.
Part No. ATS014014004-SF-3C
Description 14.00 x 14.00 x 4.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.14K  /  1 Page

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Renesas Electronics Corporation

Part No. TSI301-400CE
Description HyperTransport to PCI Bridge
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    ATS014014006-SF-3E

Advanced Thermal Solutions, Inc.
Part No. ATS014014006-SF-3E
Description 14.00 x 14.00 x 6.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.16K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-109101400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS014014004-PF-3C

Advanced Thermal Solutions, Inc.
Part No. ATS014014004-PF-3C
Description 14.00 x 14.00 x 4.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 250.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-107101400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS014014006-PF-3E

Advanced Thermal Solutions, Inc.
Part No. ATS014014006-PF-3E
Description 14.00 x 14.00 x 6.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin Fin

File Size 249.94K  /  1 Page

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Amphenol Communications Solutions

Part No. 61083-101400LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

Official Product Page

    ATS014014009-SF-3H

Advanced Thermal Solutions, Inc.
Part No. ATS014014009-SF-3H
Description 14.00 x 14.00 x 9.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.14K  /  1 Page

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Amphenol Communications Solutions

Part No. 54242-108101400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS014014003-SF-3B

Advanced Thermal Solutions, Inc.
Part No. ATS014014003-SF-3B
Description 14.00 x 14.00 x 3.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 73277-101400LF
Description Bergstak® 0.80mm Pitch, Board to Board Receptacle, Vertical, Double Row, 100 Positions, 0.80mm (0.031in) Pitch
Tech specs    

Official Product Page

    ATS014014007-SF-3F

Advanced Thermal Solutions, Inc.
Part No. ATS014014007-SF-3F
Description 14.00 x 14.00 x 7.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Straight Fin

File Size 278.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 54122-108201400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    ATS014014005-PF-3D

Advanced Thermal Solutions, Inc.
Part No. ATS014014005-PF-3D
Description 14.00 x 14.00 x 5.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Custom Pin FIn

File Size 249.96K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-400H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 0 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ATS014014007-MF-3F

Advanced Thermal Solutions, Inc.
Part No. ATS014014007-MF-3F
Description 14.00 x 14.00 x 7.00 mm BGA Heat Sink (High Aspect Ratio Ext.) Slant Fin

File Size 279.99K  /  1 Page

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    CY8C2014009 CY8C20140-LDX2I CY8C20140-SX2I

Cypress Semiconductor
Part No. CY8C2014009 CY8C20140-LDX2I CY8C20140-SX2I
Description CapSense Express-4 Configurable IOs

File Size 265.48K  /  15 Page

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