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UVTOP335 MUN5311 HVC328C TXV1N 2405E2 4C010 SN74L HM628512
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  thinfilm Datasheet PDF File

For thinfilm Found Datasheets File :: 244    Search Time::1.875ms    
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    BOURNS[Bourns Electronic Solutions]
Part No. 2DAA-F6RLF 2DAA-F6R
OCR Text ... 2 DAA - F6R ____ GND GND thinfilm Model Flip Chip No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 5000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 EXT3 Specifications are subject...
Description Integrated Passive & Active Device

File Size 222.37K  /  4 Page

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    BOURNS[Bourns Electronic Solutions]
Part No. 2DAB-F6RLF 2DAB-F6R
OCR Text ...XT5 OR GND 2 DAB - F6R ____ thinfilm Model Flip Chip No. of Solder Bumps EXT2 EXT3 Packaging Option R = Tape and Reel Packaged 5000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb Specifications are subj...
Description Integrated Passive & Active Device

File Size 222.58K  /  4 Page

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    2DAC-C16R 2DAC-C16RLF

Bourns Electronic Solutions
Part No. 2DAC-C16R 2DAC-C16RLF
OCR Text ... ____ EXT5 6.5 V 6.5 V EXT8 thinfilm Model Chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT6 6.5 V GROUND 6.5 V EXT7 GROUND ...
Description Integrated Passive & Active Device using CSP

File Size 232.59K  /  4 Page

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    2DAD-C5RLF 2DAD-C5R

BOURNS[Bourns Electronic Solutions]
Part No. 2DAD-C5RLF 2DAD-C5R
OCR Text ...der 2 DAD - C5R ____ GND thinfilm Model Chipscale No. of Solder Bumps EXT4 EXT3 Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb Specifications are subject t...
Description Integrated Passive & Active Device using CSP

File Size 213.15K  /  4 Page

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    2FAD-C20R 2FAD-C20RLF

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAD-C20R 2FAD-C20RLF
OCR Text ... to Order 2 FAD - C20R ____ thinfilm Model Chipscale No. of Solder Bumps EXT7 EXT8 Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb Fig. 4 - Device Block D...
Description Integrated Passive & Active Device using CSP

File Size 240.05K  /  4 Page

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    2FAE-C15R 2FAE-C15RLF

BOURNS[Bourns Electronic Solutions]
Bourns, Inc.
Part No. 2FAE-C15R 2FAE-C15RLF
OCR Text ...rder GND 2 FAE - C15R ____ thinfilm Model Chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 R2: 100 ohms INT2 EXT3 R3: 1...
Description Integrated Passive & Active Device using CSP

File Size 219.15K  /  4 Page

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    2FAG-C15RLF 2FAG-C15R

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAG-C15RLF 2FAG-C15R
OCR Text ...er GND 2 FAG - C15R ____ thinfilm Model Chipscale No. of Solder Bumps EXT2 R2: 100 ohms INT2 Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT3 R3...
Description Integrated Passive & Active Device using CSP

File Size 241.38K  /  4 Page

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    2FAK-C15R 2FAK-C15RLF

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAK-C15R 2FAK-C15RLF
OCR Text ...rder GND 2 FAK - C15R ____ thinfilm Model Chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 R1: 100 ohms INT2 EXT3 R2: 1...
Description Integrated Passive & Active Device using CSP

File Size 218.89K  /  4 Page

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    2FAM-C5RLF 2FAM-C5R

Bourns, Inc.
BOURNS[Bourns Electronic Solutions]
Part No. 2FAM-C5RLF 2FAM-C5R
OCR Text ...der 2 FAM - C5R ____ GND thinfilm Model Chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 INT2 R2: 10 OHMS Specificati...
Description Integrated Passive & Active Device using CSP

File Size 235.85K  /  4 Page

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    2FAN-C5R 2FAN-C5RLF

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Bourns Electronic Solutions
Bourns, Inc.
Part No. 2FAN-C5R 2FAN-C5RLF
OCR Text ...der 2 FAN - C5R ____ GND thinfilm Model Chipscale No. of Solder Bumps Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 " reel Terminations LF = Sn/Ag/Cu (lead free) Blank = Sn/Pb EXT2 INT2 R2: 68 OHMS Specificati...
Description Integrated Passive & Active Device using CSP

File Size 240.61K  /  4 Page

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For thinfilm Found Datasheets File :: 244    Search Time::1.875ms    
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