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    CLS01

Toshiba Corporation
Toshiba Semiconductor
Part No. CLS01
OCR Text ...0 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm Min Typ. 0.34 0.38 0.45 8.0 0.1 530 Max 0.47 1.0 A mA pF V Unit Thermal resistance (junction to ambient) Rth (j-a) 100...
Description Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage)
File Size 204.69K  /  5 Page

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    LTL29S LBL29S

OSRAM GmbH
Part No. LTL29S LBL29S
OCR Text ... for all SMT assembly methods * soldering methods: IR reflow soldering and TTW soldering * preconditioning: acc. to JEDEC Level 2 * taping: 8 mm tape with 5000/reel, o180 mm * ESD-withstand voltage: up to 2 kV acc. to JESD22-A114-B Applicat...
Description Lead (Pb) Free Product - RoHS Compliant
File Size 281.32K  /  15 Page

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    ESD7951ST5G

ON Semiconductor
Part No. ESD7951ST5G
OCR Text ...n on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. c...
Description Transient Voltage Suppressors
File Size 105.54K  /  4 Page

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