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ST Microelectronics
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| Part No. |
EMIF02-USB01F2
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| OCR Text |
...p x = 1: 500m, bump = 315m = 2: leadfree pitch = 500m, bump = 315m = 3: leadfree pitch = 400m, bump = 250m 495m 50 495m 50 1.27mm 50m 1.97mm 50m 315 50 700 50 650m 65 copper pad diameter : 250m recommended , 300m max solder stencil ... |
| Description |
2 LINES EMI FILTER INCLUDING ESD PROTECTION
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| File Size |
75.67K /
7 Page |
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it Online |
Download Datasheet
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ST Microelectronics
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| Part No. |
EMIF10-1K010
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| OCR Text |
...
1: Pitch = 500m Bump = 315m 2: leadfree Pitch = 500m Bump = 315m 3: leadfree Pitch = 400m Bump = 250m 4: Pitch = 500m Bump = 250m Flip Chip
x: resistance value (Ohms) z: capacitance value / 10(pF) or Application (3 letters) and Version ... |
| Description |
EMI FILTER INCLUDING ESD PROTECTION
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| File Size |
154.00K /
6 Page |
View
it Online |
Download Datasheet |
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Littelfuse, Inc.
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| Part No. |
268
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| OCR Text |
leadfree
Specifications
Mounting
For direct soldering to PC Boards. Leads should not be twisted or bent closer than 3mm from the cap. Sharp bending of the leads can cause mechanical weakness followed by breaking of the leads. Holder: A... |
| Description |
MINIATURE FUSEHOLDERS
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| File Size |
106.09K /
1 Page |
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it Online |
Download Datasheet |
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ST Microelectronics
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| Part No. |
EMIF10-COM01F2
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| OCR Text |
...p x = 1: 500m, Bump = 315m = 2: leadfree Pitch = 500m, Bump = 315m = 3: leadfree Pitch = 400m, Bump = 250m
yy
-
xxx zz
Fx
Figure 11: FLIP-CHIP Package Mechanical Data
500m 50 315m 50
650m 65
500m 50
2.64mm 50m
... |
| Description |
EMI FILTER INCLUDING ESD PROTECTION
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| File Size |
97.48K /
7 Page |
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it Online |
Download Datasheet |
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GREATECS
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| Part No. |
DX1
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| OCR Text |
...rcuit: single pole single throw leadfree soldering processes ? wave soldering: recommended solder temperature at 260c max. 5 seconds for thru hole type ? ref ow soldering: when applying ref ow soldering, the peak temperature of the ... |
| Description |
SPST Standard DIP Switches
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| File Size |
301.85K /
1 Page |
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it Online |
Download Datasheet |
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ST Microelectronics
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| Part No. |
EMIF04-VID01F2
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| OCR Text |
...2 digits = version Package F2 = leadfree Flip-Chip x = 1: 500m, Bump = 315m = 2: leadfree Pitch = 500m, Bump = 315m
yy
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xxx zz
Fx
Figure 9: FLIP-CHIP Package Mechanical Data
315m 50 500m 50 250m 50
435m 50
650m ... |
| Description |
4 LINES LOW CAPACITANCE EMI FILTER AND ESD PROTECTION
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| File Size |
150.61K /
6 Page |
View
it Online |
Download Datasheet |
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ST Microelectronics
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| Part No. |
EMIF010-COM01F2
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| OCR Text |
...p x = 1: 500m, Bump = 315m = 2: leadfree Pitch = 500m, Bump = 315m = 3: leadfree Pitch = 400m, Bump = 250m
yy
-
xxx zz
Fx
Figure 11: FLIP-CHIP Package Mechanical Data
500m 50 315m 50
650m 65
500m 50
2.42mm 50m
... |
| Description |
EMI FILTER INCLUDING ESD PROTECTION
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| File Size |
148.62K /
7 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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