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glass ceramic Datasheet PDF File

For glass ceramic Found Datasheets File :: 3351 Search Time::2.89ms
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				Intersil, Corp. INTERSIL[Intersil Corporation]
Part No.	CDP1871 CDP1871A CDP1871AC CDP1871ACD CDP1871ACDX CDP1871ACE CDP1871ACQ CDP1871AD CDP1871AE FN1374
OCR Text	...um area x 1.6mm thick G10 epoxy glass, or equivalent. Static Electrical Specifications At TA = -40 to +85oC, Unless Otherwise Specified CONDITIONS CDP1871AD CDP1871AE VO (V) VIN (V) 0.5 0, 10 0, 5 0, 10 0, 5 0, 10 0, 5 0, 10 VDD (V) 5...
Description	CMOS Keyboard Encoder SPECIALTY MICROPROCESSOR CIRCUIT, CDIP40 CMOS Keyboard Encoder SPECIALTY MICROPROCESSOR CIRCUIT, PQCC44 CMOS Keyboard Encoder SPECIALTY MICROPROCESSOR CIRCUIT, PDIP40 CMOS Keyboard Encoder 键盘编码器的CMOS From old datasheet system
File Size	56.08K / 10 Page	View it Online	Download Datasheet

				MOTOROLA INC ON Semi MOTOROLA[Motorola, Inc]
Part No.	DAP222 DAP222_D ON0276
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 150 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board mate...
Description	SOT-416/SC-90 PACKAGE COMMON ANODE DUAL SWITCHING DIODE SURFACE MOUNT SOT-16/SC-0 PACKAGE COMMON ANODE From old datasheet system
File Size	88.38K / 6 Page	View it Online	Download Datasheet

				Alpha Industries Inc ALPHA[Alpha Industries] Alpha Industries, Inc.
Part No.	DME3930 DME3930-102 DMJ3928 DMJ3928-100 DMJ3928-101 DMF3945 DMF3945-103 DMF3948 DMF3948-106 DME3927 DME3927-100 DME3927-101 DME3946 DME3946-103 DME3949 DME3949-106 DMF3926 DMF3926-100 DMF3926-101 DMF3929 DMF3929-102 DMJ3931 DMJ3931-102 DMJ3947 DMJ3947-10 DMJ3947-103 DMJ3950 DMJ3950-106 DMF3927-100 DMF3927-101 DMF3928-100 DMF3928-101 DMF3930-102 DMF3931-102 DMF3946-103 DMF3947-103 DMF3949-106 DMF3950-106
OCR Text	...2 DOT 1 0.026 (0.66 mm) MIN. () glass DAM 0.120 (3.05 mm) +0.002 (0.05 mm) -0.004 (0.10 mm) 0.020 (0.51 mm) X 0.010 (0.25 mm) ORIENTATION MA...ceramic SUBSTRATE Notes: 1. Bottom side is free of metalization. 2. The minimum specified area of th...
Description	Chip on board mixer quad (to 6 GHz) Chip On Board Mixer Quads 芯片板搅拌机四边 Chip on board mixer quad (to 10 GHz)
File Size	33.75K / 3 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	DTC144T1 DTC144TT1
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 338 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board mate...
Description	NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network Bias Resistor Transistor
File Size	52.59K / 8 Page	View it Online	Download Datasheet

				Sanyo Semicon Device
Part No.	LA8518NM
OCR Text	...output). 120 x 120 x 1.5 mm3 glass epoxy board Independent IC Ambient temperature, Ta - C SANYO Electric Co.,Ltd. Semiconductor Bus...ceramic receiver c The Receiver Amplifier Attenuator Normally, the attenuator is set to -6 dB....
Description	Signal Processor for Cordless Telephone Base Sets
File Size	469.74K / 31 Page	View it Online	Download Datasheet

				Motorola Inc Motorola, Inc. ONSEMI[ON Semiconductor] MOTOROLA[Motorola, Inc]
Part No.	M1MA151KT1 ON0328 M1MA152KT1
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board mate...
Description	Inductor Kit RoHS Compliant: Yes From old datasheet system SC-59 PACKAGE SINGLE SILICON SWITCHING DIODES 40/80 V-100 mA SURFACE MOUNT
File Size	81.39K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MGSF1P02LT1 MGSF1P02LT3
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternat...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	P-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
File Size	195.68K / 6 Page	View it Online	Download Datasheet

				ON Semiconductor Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAT54SLT1 ON0127
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternat...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	From old datasheet system 30 VOLTS DUAL HOT-CARRIER DETECTOR AND SWITCHING DIODES 30 VOLTS DUAL HOT-ARRIER
File Size	78.32K / 4 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola Inc] ONSEMI[ON Semiconductor] MOTOROLA[Motorola, Inc]
Part No.	BAT54SWT1 ON0128
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board mate...
Description	30 VOLT DUAL SERIES SCHOTTKY BARRIER DIODES From old datasheet system
File Size	78.90K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	BC817-16LT1 BC817-40LT3 BC817-25LT2 ON0159
OCR Text	... the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternat...ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as T...
Description	General Purpose Transistors(NPN Silicon) CASE 318-8, STYLE6 SOT-23(TO-236AB) From old datasheet system
File Size	67.03K / 4 Page	View it Online	Download Datasheet

For glass ceramic Found Datasheets File :: 3351 Search Time::2.89ms
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