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Amphenol Communications Solutions |
| Part No. |
RJSSE558002
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| Description |
Modular Jack - Right Angle, Input Output Connectors 8P8C, Shield, No Light Pipes.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10070158-00219XLF
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| Description |
D-Sub MicroTCA Connectors, Input Output Connectors, Dual PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Carton Box.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0015800281 70567-0012 15-80-0281
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating MOLEX Connector
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
RJSSE558002T
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| Description |
Modular Jack - 8P8C, Right Angle, Surface Mount, Two Port, Shield With Top and Side EMI Tabs, No Light Pipes
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0011 A-70567-0011 0015800261
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
70567-0010 A-70567-0010 0015800241
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
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| File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
0015800209 15-80-0209 A-70567-0280
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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| File Size |
1,218.34K /
7 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
0015800207 15-80-0207 A-70567-0212
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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| File Size |
1,218.31K /
7 Page |
View
it Online |
Download Datasheet
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