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  43045-1811 Datasheet PDF File

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    43045-1802

Molex Electronics Ltd.
Part No. 43045-1802
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 18 Circuits
File Size 190.63K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    43045-0613

Molex Electronics Ltd.
Part No. 43045-0613
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions
Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs 　 　

Official Product Page

    43045-1806

Molex Electronics Ltd.
Part No. 43045-1806
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.21K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-8118-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    43045-1808

Molex Electronics Ltd.
Part No. 43045-1808
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Press-fit Metal Retention Clip, 18 Circuits
File Size 184.24K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-8118-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    43045-1809

Molex Electronics Ltd.
Part No. 43045-1809
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Right Angle, with Solder Tab, 18 Circuits
File Size 176.77K  /  3 Page

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Amphenol Communications Solutions
Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    43045-1820

Molex Electronics Ltd.
Part No. 43045-1820
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount, Dual Row, Vertical, with Solder Tab, 18 Circuits
File Size 175.82K  /  3 Page

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Amphenol Communications Solutions
Part No. 68418-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs 　 　

Official Product Page

    43045-0614

Molex Electronics Ltd.
Part No. 43045-0614
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-118-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    43045-0600

Molex Electronics Ltd.
Part No. 43045-0600
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-418-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    43045-0601

Molex Electronics Ltd.
Part No. 43045-0601
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 6 Circuits
File Size 190.62K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    43045-0612

Molex Electronics Ltd.
Part No. 43045-0612
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 6 Circuits
File Size 166.51K  /  3 Page

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Amphenol Communications Solutions
Part No. 131-5618-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

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