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Amphenol Communications Solutions |
Part No. |
68602-168HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68492-168HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Microsemi, Corp. MICROSEMI[Microsemi Corporation]
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Part No. |
JHV2180 JHV21 JHV2112 JHV2116 JHV2120 JHV2124 JHV2128 JHV2132 JHV2140 JHV2144 JHV2148 JHV2152 JHV2156 JHV2160 JHV2164 JHV2168 JHV2172 JHV2176 JHV218 JHV21H68 JHV21H76 JHV21H28 JHV21H52 JHV21H64 JHV21H24
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Description |
High Voltage Rectifier; Package: SEE_FACTORY; IO (A): 22; IFSM (A): 250; Vrwm (V): 24000; IR (µA): 6000; SILICON, VOLTAGE MULTIPLIER DIODE High Voltage Rectifier; Package: SEE_FACTORY; IO (A): 22; IFSM (A): 250; Vrwm (V): 64000; IR (µA): 6000; SILICON, VOLTAGE MULTIPLIER DIODE High Voltage Rectifier; Package: SEE_FACTORY; IO (A): 22; IFSM (A): 250; Vrwm (V): 52000; IR (µA): 6000; SILICON, VOLTAGE MULTIPLIER DIODE High Voltage Rectifier; Package: SEE_FACTORY; IO (A): 22; IFSM (A): 250; Vrwm (V): 28000; IR (µA): 6000; SILICON, VOLTAGE MULTIPLIER DIODE High Voltage Rectifier; Package: SEE_FACTORY; IO (A): 22; IFSM (A): 250; Vrwm (V): 76000; IR (µA): 6000; SILICON, VOLTAGE MULTIPLIER DIODE High Voltage Rectifier; Package: SEE_FACTORY; IO (A): 22; IFSM (A): 250; Vrwm (V): 68000; IR (µA): 6000; SILICON, VOLTAGE MULTIPLIER DIODE HIGH VOLTAGE RECTIFIER ASSEMBLY
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File Size |
98.29K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
86832-168HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 68 Positions, 2.54 mm Pitch, Vertical, 8.26 mm (0.325 in.) Mating, 2.54 mm (0.1 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68692-168HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87052-168HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 68 Positions, 2.54 mm Pitch, Vertical, 19.56 mm (0.77 in.) Mating, 3.05 mm (0.12 in.) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68482-168HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68022-168HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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Part: 216D4TCASB21S |
Maker: MOBILITY |
Pack: BGA |
Stock: 244 |
Unit price
for : |
50: $12.00 |
100: $11.40 |
1000:
$10.80 |
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