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  00158 Datasheet PDF File

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    15-80-0285 0015800285

Molex Electronics Ltd.
Part No. 15-80-0285 0015800285
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 87900-158HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800203 15-80-0203

Molex Electronics Ltd.
Part No. 0015800203 15-80-0203
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.27K  /  7 Page

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    0015800449 15-80-0449

Molex Electronics Ltd.
Part No. 0015800449 15-80-0449
Description 2.54mm (.100") Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature

File Size 1,218.39K  /  7 Page

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    Murata Manufacturing Co...
Part No. SN8200UFL 88-00151-97 88-00158-02 88-00151-95 88-00151-02 88-00158-97
Description Wi-Fi 802.11 b/g/n Network Controller Module

File Size 155.26K  /  2 Page

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    A-70567-0015 0015800341

Molex Electronics Ltd.
Part No. A-70567-0015 0015800341
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating

File Size 1,218.42K  /  7 Page

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    0015800145 15-80-0145 70567-0141

Molex Electronics Ltd.
Part No. 0015800145 15-80-0145 70567-0141
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    70567-0152 A-70567-0152 15-80-0365 0015800365

Molex Electronics Ltd.
Part No. 70567-0152 A-70567-0152 15-80-0365 0015800365
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

File Size 1,218.29K  /  7 Page

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    0015800169 15-80-0169 A-70567-0278

Molex Electronics Ltd.
Part No. 0015800169 15-80-0169 A-70567-0278
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    0015800187 15-80-0187 A-70567-0211

Molex Electronics Ltd.
Part No. 0015800187 15-80-0187 A-70567-0211
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.53K  /  7 Page

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    0015800281 70567-0012 15-80-0281

Molex Electronics Ltd.
Part No. 0015800281 70567-0012 15-80-0281
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
MOLEX Connector

File Size 1,218.43K  /  7 Page

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