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Molex Electronics Ltd.
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Part No. |
15-80-0101 70567-0003 A-70567-0003 0015800101
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.41K /
7 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0121 A-70567-0004 0015800121 705670004
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.42K /
7 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0081 A-70567-0002 0015800081 705670002
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.39K /
7 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0141 A-70567-0005 0015800141 705670005
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.38K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0015800281 70567-0012 15-80-0281
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating MOLEX Connector
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File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0089 0015800089 A-70567-0274
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat Molex Electronics Ltd.
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File Size |
1,218.52K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0083 0015800083
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati Molex Electronics Ltd.
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File Size |
1,218.46K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0125 0015800125 70567-0140
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Description |
2.54mm (.100) Pitch C-Grid? header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 header, Through Hole without Peg, Dual Row, Vertical, shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla Molex Electronics Ltd.
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File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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