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    Atmel
Part No. UG1
OCR Text ... be done during the fpga design process to reduce the ulc conversion schedule and risk. this application note is probably not needed by an e...ing variations. timing variations occur as the chip oper- ates over a temperature range, and due to...
Description 0.6 um ULC Series

File Size 32.83K  /  7 Page

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    Aptina Imaging Corporation
Part No. MT9N011
OCR Text ...during the module manufacturing process, is not shown in figure 1. this pad is left unconnected during normal operation. 6. the parallel interface output pads can be left unconnected if the serial output interface is used. 7. aptina recomm...
Description 9Mp CMOS Active-Pixel Digital Image Sensor Die

File Size 743.70K  /  17 Page

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    STA015

STMicroelectronics
Part No. STA015
OCR Text ...it to 32 bits). during encoding process two different interfaces can be used to feed data: the serial input interface (same interface used a...ing bitstream. this value can be even set by the user to select the pcm interface configuration. the...
Description    MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY

File Size 720.14K  /  55 Page

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    Advanced Communication Devices
Part No. ACD82112
OCR Text ... technology, can simultaneously process 12 asyn- chronous 10/100mbps traffics. the queue manager in- side the acd82112 provides the capabili...ing operation at wire speeds for a high throughput and high port density ethernet switch. the on-chi...
Description 12 ports 10/100 fast ethernet switch.

File Size 375.57K  /  44 Page

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    HW-USB-FLYLEADS-G HW-USB-II-G DLC10 HW-RIBBON14

Xilinx, Inc
Part No. HW-USB-FLYLEADS-G HW-USB-II-G DLC10 HW-RIBBON14
OCR Text ...to 40 seconds. do not stop the process or disconnect the cable prior to completion. the cable status led will be red for the duration of t...ing other xilinx design tools or methods, please refer to the appropriate software user guide. se...
Description Platform Cable USB II

File Size 3,417.62K  /  35 Page

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    RCLAMP3304P.TCT RCLAMP2504P.TCT RCLAMP2504P RCLAMP3304P

Semtech Corporation
Part No. RCLAMP3304P.TCT RCLAMP2504P.TCT RCLAMP2504P RCLAMP3304P
OCR Text ...using Semtech's proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage cu...ing Voltage Clamp ing Voltage Junction Cap acitance Symbo l VRWM V PT VSB IR VC VC Cj Conditions Pin...
Description RailClamp2.5V & 3.3V TVS Arrays
RailClamp? 2.5V & 3.3V TVS Arrays
RailClamp㈢ 2.5V & 3.3V TVS Arrays

File Size 196.65K  /  11 Page

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    HSMY-C680

AVAGO TECHNOLOGIES LIMITED
Part No. HSMY-C680
OCR Text ...ible with ir refow soldering process only. package dimensions features ? right angle mounting ? compatible with ir refow soldering proc...ing , r ef er t o ap - plica tion not e an-1060, sur fac e m oun ting sm t led i ndica t o...
Description Right Angle Surface Mount ChipLEDs

File Size 327.14K  /  8 Page

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    Spansion Inc.
Spansion, Inc.
Part No. AM75PDL193CHHA AM75PDL193CHHA70I AM75PDL191CHHA70I
OCR Text ... device manufactured on 0.13 m process technology 20-year data retention at 125c minimum 1 million erase cycle guarantee per sector perfo...ing system performance. the device can be organized in both top and bottom sector configurations. th...
Description 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory SPECIALTY MEMORY CIRCUIT, PBGA73

File Size 882.15K  /  129 Page

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    S72NS256N

SPANSION
Part No. S72NS256N
OCR Text ...nt phases in the manufacturing process that occur before full pr oduction is achieved. changes to the technical specifications presented i...ing the spansion product(s) described herein. the preliminary status of th is document indicates th...
Description Based MCPs

File Size 326.77K  /  17 Page

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