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For mils Found Datasheets File :: 5731    Search Time::0.86ms    
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    CZR1-04C CMR1-02 CXR1-04 CPD69 CMR1-02M

Central Semiconductor Corp
Part No. CZR1-04C CMR1-02 CXR1-04 CPD69 CMR1-02M
OCR Text ...d mesa die size 42.5 x 42.5 mils die thickness 12.5 mils anode bonding pad area 32 x 32 mils top side metalization ni/au - 5,000?/2,000? back side metalization ni/au - 5,000?/2,000? www.centralsemi.com r5 (5-april 2011) ...
Description 1 Amp Glass Passivated Rectifier Chip

File Size 398.72K  /  2 Page

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    HCNW136-300E

AVAGO TECHNOLOGIES LIMITED
Part No. HCNW136-300E
OCR Text ... lead protrusion is 0.25 mm (10 mils) max. 3.56 0.13 (0.140 0.005) package outline drawings 8-pin dip package (6n135/6, hcpl-2502) 8-pin dip package with gull wing surface mount option 300 (6n135/6) 0.635 0.25 (0.025 0.010) 12 nom. 9....
Description Single Channel, High Speed Optocouplers

File Size 358.98K  /  16 Page

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    CP317V PN3564 PN3563 2N918 2N5770

Central Semiconductor Corp
Central Semiconductor C...
Part No. CP317V PN3564 PN3563 2N918 2N5770
OCR Text ...planar die size 14.5 x 14.5 mils die thickness 7.1 mils base bonding pad area 2.4 x 2.2 mils emitter bonding pad area 2.4 x 2.2 mils top side metalization al - 30,000? back side metalization au - 18,000? www.centrals...
Description NPN - RF Transistor Chip
   NPN - RF Transistor Chip

File Size 444.16K  /  2 Page

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    CBCX68 MPS650 MPS651

Central Semiconductor Corp
Central Semiconductor C...
Part No. CBCX68 MPS650 MPS651
OCR Text ...ial planar die size 40 x 40 mils die thickness 7.1 mils base bonding pad area 7.9 x 8.7 mils emitter bonding pad area 9.0 x 14 mils top side metalization al - 30,000? back side metalization au-as - 13,000? www.centra...
Description NPN - High Current Transistor Chip

File Size 456.53K  /  2 Page

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    GAASPINDIODECHIPS

M/A-COM Technology Solutions, Inc.
Part No. GAASPINDIODECHIPS
OCR Text ... anode a b c b dimension mils millimeters a 7 .5 .178 .013 b 11 1 .279 .025 c 2.2 .3 .056 .008 typical ttl driver circuit ...
Description May be Driven Directly by TTL Signals

File Size 334.77K  /  6 Page

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    HMC26508

Hittite Microwave Corporation
Part No. HMC26508
OCR Text ...of minimal length <0.31 mm (<12 mils). This downconverter IC is an excellent, smaller, and more reliable replacement to hybrid diode based downconverter MMIC assemblies. Electrical Specifi cations, TA = +25 C, LO Drive = -4 dBm Paramete...
Description GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER, 20 - 32 GHz

File Size 253.15K  /  6 Page

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    CP328X

Central Semiconductor Corp
Part No. CP328X
OCR Text ...etails die size 15.7 x 15.7 mils die thickness 5.5 mils gate bonding pad area 3.9 x 3.9 mils source bonding pad area 9.1 x 8.1 mils top side metalization al-si 30,000? back side metalization au - 9,000? www.centralse...
Description N-Channel Enhancement-Mode MOSFET Chip

File Size 690.02K  /  2 Page

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    HMC26408

Hittite Microwave Corporation
Part No. HMC26408
OCR Text ...of minimal length <0.31 mm (<12 mils). Electrical Specifi cations, TA = +25 C, As a Function of LO Drive & Vdd Parameter IF = 1 GHz LO = 0 dBm & Vdd = +4V Min. Frequency Range, RF Frequency Range, LO Frequency Range, IF Conversion Loss ...
Description GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 32 GHz

File Size 320.00K  /  8 Page

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    HMC26307

Hittite Microwave Corporation
Part No. HMC26307
OCR Text ... of minimal length 0.31 mm (<12 mils). The HMC263 may be used in conjunction with HMC264 or HMC265 mixers to realize a millimeterwave system receiver. Electrical Specifi cations, TA = +25 C, Vdd = +3V Parameter Frequency Range Gain Gain...
Description GaAs MMIC LOW NOISE AMPLIFIER, 24 - 36 GHz

File Size 227.80K  /  6 Page

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