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SGS Thomson Microelectronics
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| Part No. |
AN900
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| OCR Text |
...igh energy electron beam. metal deposition it allows the realization of electrical connections between the different cells of the integrated circuit and the outside. two different methods are used to deposit the metal: evaporation or sputte... |
| Description |
MCUS - INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY
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| File Size |
488.36K /
15 Page |
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it Online |
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Agilent (Hewlett-Packard)
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| Part No. |
HSMS-286C HSMS-2865
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| OCR Text |
...semiconductor barrier formed by deposition of a metal layer on a semiconductor. the most common of several different types, the passivated diode, is shown in figure 7, along with its equivalent circuit. figure 7. schottky diode chip. r s i... |
| Description |
HSMS-286C · High frequency detector diode
HSMS-2865 · High frequency detector diode
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| File Size |
198.56K /
17 Page |
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it Online |
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Hamamatsu Photonics K.K.
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| Part No. |
C9252DK-14
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| OCR Text |
...t ttl - scintillator direct deposition csi - absolute maximum ratings (ta=25 c) parameter symbol value unit supply voltage for digital circuitry (+5 v) d.vdd +6.0 v supply voltage for analog circuitry (+5 v) a.vdd +6.0 ... |
| Description |
Flat panel sensor Large area with tiling construction, high-speed frame rate 平板传感器平铺建设高速帧速率大面
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| File Size |
141.62K /
9 Page |
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it Online |
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Hamamatsu Photonics K.K.
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| Part No. |
C9730DK-10
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| OCR Text |
...rgout ttl - scintillator direct deposition csi - absolute maximum ratings (ta=25 c) parameter symbol value unit supply voltage for digital circuitry (+5 v) d.vdd +6.0 v supply voltage for analog circuitry (+5 v) a.vdd +6.0 v operating tem... |
| Description |
Large area soft X-ray imaging, high resolution 大面积软X射线成像，高分辨
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| File Size |
83.72K /
4 Page |
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it Online |
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OMRON Scientific Technologies, Inc.
Sumida, Corp.
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| Part No. |
D4B-7516N D4B-7513N D4B-7511N D4B-3113N D4B-3511N
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| OCR Text |
... contact (snap-action) if metal deposition between mating contacts occurs on the nc contact side, they can be pulled apart by the shearing force and t ensile force generated when part b of the safety cam or plunger engages part a of the mo... |
| Description |
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| File Size |
347.45K /
19 Page |
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it Online |
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QuickLogic Corp.
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| Part No. |
QL3004
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| OCR Text |
...ink elements between the metal deposition steps. figure 3. four layer metal vialink ? structure as the size of a vialink ? via is identical to that of a standard metal interconnect via, programmable ele- ments can be packed very densely... |
| Description |
pASIC 3 FPGA Family High Performance and High Density with Low Cost and Complete Flexibiltiy(具有低成本和充分灵活性的高性能和高密度的pASIC 3现场可编程门阵列)
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| File Size |
236.66K /
10 Page |
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it Online |
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