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				MIMIX[Mimix Broadband]
Part No.	XS1000
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. The device is well suited for radar applications. Absolute Maximum Ratings Supply Voltag...
Description	7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter
File Size	498.75K / 6 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XX1000
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	7.5-25.0/15.0-50.0 GHz GaAs MMIC Active Doubler
File Size	493.86K / 6 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XX1002
OCR Text	... and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT a...
Description	2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
File Size	370.74K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-AUH232
OCR Text	...e of chip Thermal resistance to backside of carrier using 25.4 um of 84-1LMIT epoxy Thermal Resistance to back side of chip Thermal resistance to backside of carrier using 25.4 um of 84-1LMIT epoxy PDISS (W) 1.25 1.25 1.25 1.25 TBASE (C) 85...
Description	GaAs HEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 43 GHz
File Size	209.14K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC572
OCR Text	... BOND PAD METALIZATION: GOLD 4. backside METALIZATION: GOLD 5. backside METAL IS GROUND 6. OVERALL DIE SIZE 0.002 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824...
Description	GaAs MMIC I/Q DOWNCONVERTER 24 - 28 GHz
File Size	261.22K / 8 Page	View it Online	Download Datasheet

				ATMEL Corporation
Part No.	ATA6612C14 ATA6612C-14
OCR Text	...port b 4 i/o line (miso/pcint4) backside heat slug is connected to gnd table 1-1. pin description (continued) pin symbol function note: 1. this identifies the pins of the lin sbc atmel ata6624 5 ata6612c/ata6613c [datasheet] 9111l?auto?11...
Description	8K/16K Flash Microcontroller with LIN Transceiver, 5V Regulator and Watchdog
File Size	7,759.37K / 312 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ABH241
OCR Text	...tage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation. The HMC-ABH241 GaAs HEMT MMIC Medium Power Amplifier is compatible with conventional die attach methods, as w...
Description	GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz
File Size	139.92K / 3 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-MDB171
OCR Text	...nals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation. The HMC-MDB171 I/Q MMIC Mixer is compatible with conventional die attach methods, as well as thermocompressio...
Description	GaAs MMIC I/Q MIXER 35 - 45 GHz
File Size	79.25K / 4 Page	View it Online	Download Datasheet

For backside Found Datasheets File :: 6203 Search Time::1.828ms
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