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  80-bga Datasheet PDF File

For 80-bga Found Datasheets File :: 3005    Search Time::1.078ms    
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    UPD77113A UPD77113AF1-XXX-CN1 UPD77114 UPD77114GC-XXX-9EU

NEC[NEC]
Part No. UPD77113A UPD77113AF1-XXX-CN1 UPD77114 UPD77114GC-XXX-9EU
OCR Text ...NFORMATION Part Number Package 80-pin plastic fine-pitch BGA (9 x 9) 100-pin plastic TQFP (fine pitch) (14 x 14) PD77113AF1-xxx-CN1 PD77114GC-xxx-9EU Remark xxx indicates ROM code suffix. The information in this document is subjec...
Description MOS INTEGRATED CIRCUIT

File Size 339.46K  /  62 Page

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    CRR05-1AS CRR05-1AS12

Meder Electronic
Part No. CRR05-1AS CRR05-1AS12
OCR Text ...in. typ. max. max. min. typ. 1a 80 5 7.5 135 150 165 3.5 0.75 167 1a 80 3 5 63 70 77 2.25 0.45 129 1b 80 5 7.5 117 130 143 3.75 0.75 192 1b 80 3 5 63 70 77 2.25 0.45 129 * the pull-in / drop-out voltages and coil resistance will change at t...
Description SPST Reed Relays

File Size 412.27K  /  3 Page

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    VICOR[Vicor Corporation]
Part No. B048L120T15 B048F120T15 B048G120T15 B048K120T15
OCR Text ...wer Dissipation (W) 0 20 40 60 80 100 120 140 95 Efficiency (%) 5 94 93 92 91 90 89 88 4 3 2 1 0 0 20 40 60 80 1...BGA thermal impedance Junction-to-ambient 1 Junction-to-ambient 2 PRELIMINARY Min 125 Typ 1...
Description VI Chip - BCM Bus Converter Module

File Size 515.83K  /  16 Page

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    VICOR[Vicor Corporation]
Part No. B048L120T10 B048F120T10 B048G120T10 B048K120T10
OCR Text ...ion (W) 0 10 20 30 40 50 60 70 80 90 100 94 3 2.5 2 1.5 1 0.5 0 0 10 20 30 40 50 60 70 80 90 100 Efficiency (%) 92 90 88 ...BGA thermal impedance Junction-to-ambient 1 Junction-to-ambient 2 PRELIMINARY Min 125 Typ 1...
Description VI Chip - BCM Bus Converter Module

File Size 722.67K  /  16 Page

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    GS881E18BD-150I GS881E36BD-300 GS881E32BD-300I GS881E36BD-150 GS881E18BD-200 GS881E36BD-200 GS881E32BD-333 GS881E32BD-20

GSI Technology
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Part No. GS881E18BD-150I GS881E36BD-300 GS881E32BD-300I GS881E36BD-150 GS881E18BD-200 GS881E36BD-200 GS881E32BD-333 GS881E32BD-200 GS881E18BD-333 GS881E18BD-300 GS881E36BD-333I GS881E18BD-300I GS881E36BD-300I GS881E18BD-333I GS881E32BD-333I GS881E36BT-300 GS881E32BT-300 GS881E18BT-333 GS881E32BT-150 GS881E18BT-300 GS881E36BT-333
OCR Text ...00-pin tq fp pinout (package t) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 1 2 3 4 5 6 7 8 9 ...bga?x18 commom i/o?top view (package d) 1234567891011 anc ae1 bb nc e3 bw adsc adv a aa bnc ae2ncba...
Description 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs

File Size 603.37K  /  40 Page

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    Vicor, Corp.
VICOR[Vicor Corporation]
Part No. B048K120T30 B048F120M30 B048F120T30 B048K120M30
OCR Text ... 2.8 1/4 11.7 355 200 1 0 0 308 80 214 Min 9.5 9.2 0 Typ Max 13.7 13.4 25 37.5 36.3 10 Unit Vdc Vdc Adc A Adc % % % nH F F Vd...BGA thermal impedance Junction-to-ambient (1) Junction-to-ambient (2) (continued) V*I Chip Vol...
Description VI Chip - BCM Bus Converter Module 六芯 BCM的总线转换器模

File Size 567.78K  /  15 Page

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    DS2030W-100

Maxim Integrated Products
Part No. DS2030W-100
OCR Text ... -20 -10 0 10 20 30 40 50 60 70 80 TEMPERATURE (C) VCC = 3.3V VBAT = VCHRG 3.00 3.5 WRITE PROTECT, VTP (V) 2.95 VOH (V) -40 -20 ...BGA substrate. Unlike other surface-mount NV memory modules that require the battery to be removable...
Description 3.3V Single-Piece 256k Nonvolatile SRAM

File Size 607.22K  /  12 Page

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    VICOR[Vicor Corporation]
Part No. B048K030T21 B048K030M21
OCR Text ... 5 94.5 94.1 1.1 254 16,100 3.4 80 8.6 3.6 2.6 1/16 1.8 66 200 1 0 0 285 80 100 Min 2.38 2.24 0 Typ Max 3.43 3.29 70 105 94.5 10 ...BGA thermal impedance Junction-to-ambient (1) Junction-to-ambient (2) (continued) V*I Chip Bus...
Description VI Chip - BCM Bus Converter Module

File Size 562.83K  /  15 Page

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    Atmel Corp.
聚兴科技股份有限公司
ATMEL[ATMEL Corporation]
Part No. AT73C204 AT73C204-EK AT73C204-EK2 AT73C204-EK1
OCR Text 80 mA/2.8V Dual-mode LDO for Memories (LDO1) 130 mA/2.7V/2.8V LDO for Camera Module (LDO2) 130 mA/2.8V LDO for Analog Section Supply of Audi...BGA Package Power Management for Mobiles (PM) AT73C204 Description The AT73C204 device provid...
Description From old datasheet system
Power Management for Mobiles (PM)
The AT73C204 provides an integrated power management solution for the add-on features in new-generation mobile phones. These features include a camera module, sound system for polyphonic ringing tones, memory module for downloaded MP3 file

File Size 166.66K  /  18 Page

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