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  75757-0261 Datasheet PDF File

For 75757-0261 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    0757575141 75757-5141

Molex Electronics Ltd.
Part No. 0757575141 75757-5141
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, 2.50μm(100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 2.50μm(100μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. UE863T662020261
Description 2X6SFP ULTRAPORT WITH L/P
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0757575221 75757-5221

Molex Electronics Ltd.
Part No. 0757575221 75757-5221
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10203TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    DMC20261H

Optrex Corporation
Part No. DMC20261H
Description 20characters x 2lines; 5x8dots (1character); 0.3-7.0V 2.0mA LCD module

File Size 160.34K  /  15 Page

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Amphenol Communications Solutions

Part No. 10025026-10103TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    BFL402612

Sanyo Semicon Device
Part No. BFL402612
Description General-Purpose Switching Device Applications

File Size 374.91K  /  7 Page

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Amphenol Communications Solutions

Part No. 10025026-10200TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    Toshiba
Part No. RN1409 RN1407 E002619
Description SWITCHING, INVERTER CIRCUIT, INTERFACE CIRCUIT AND DRIVER CIRCUIT APPLICATIONS
From old datasheet system

File Size 221.64K  /  5 Page

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Amphenol Communications Solutions

Part No. 51940-261LF
Description PwrBlade®, Power Supply Connectors, 128S Vertical Receptacle.
Tech specs    

Official Product Page

    Toshiba
Part No. RN1310 RN1311 E002615
Description SWITCHING, INVERTER CIRCUIT, INTERFACE CIRCUIT AND DRIVER CIRCUIT APPLICATIONS
From old datasheet system

File Size 165.93K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10002PLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch .
Tech specs    

Official Product Page

    0757570132 75757-0132

Molex Electronics Ltd.
Part No. 0757570132 75757-0132
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits

File Size 99.29K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-410261920LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0757571261

Molex Electronics Ltd.
Part No. 0757571261
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-810261100LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0757570151 75757-0151

Molex Electronics Ltd.
Part No. 0757570151 75757-0151
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. UE863G242060261
Description 2X2SFP ULTRAPORT COMBO
Tech specs    

Official Product Page

    0757570152 75757-0152

Molex Electronics Ltd.
Part No. 0757570152 75757-0152
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25um (50u) Nickel (Ni) Overall
MOLEX Connector

File Size 99.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-810261950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 75757-0261 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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