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Molex Electronics Ltd.
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| Part No. |
0526103071 52610-3071
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 30 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 30 CircuitsLead-free, High Barrier Packaging
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| File Size |
504.02K /
9 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10150526-1011HLF
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| Description |
2.0MM WIRE TO BOARD HEADER
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0526103072 52610-3072
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 30 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 30 Circuits, Lead-free, High Barrier Packaging
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| File Size |
523.95K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
85261-001LF
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| Description |
Din Accessory Locking Frame 3x16
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95157-112LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
35725-2610 0357252610
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| Description |
Flag Quick Disconnect, Female, for 14-18 AWG (2.00-0.80mm虏) Wire, Metal Strip, Tab 6.35 by 0.81mm (.250 by .032"), Open Barrel Flag, Tin Plating
Flag Quick Disconnect, Female, for 14-18 AWG (2.00-0.80mm2) Wire, Metal Strip, Tab 6.35 by 0.81mm (.250 by .032), Open Barrel Flag, Tin Plating
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| File Size |
115.14K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69157-172H
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95157-116VLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69157-102HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 2 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69157-126HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 26 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
52610-1671 0526101671
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 16 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 16 CircuitsLead-free, High Barrier Packaging
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| File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69157-146HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0526101071 52610-1071
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 10 CircuitsLead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF Receptacle, 10 CircuitsLead-free, High Barrier Packaging
MOLEX Connector
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| File Size |
504.02K /
9 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
69157-166HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0526101072 52610-1072
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| Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 10 Circuits, Lead-free, High Barrier Packaging
1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 10 Circuits, Lead-free, High Barrier Packaging
MOLEX Connector
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| File Size |
523.96K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95157-108V
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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