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  435-1314-001 Datasheet PDF File

For 435-1314-001 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM1314-30L
Description MICROWAVE POWER GaAs FET

File Size 38.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4114-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Part No. FLM1314-18F
Description X,Ku-Band Internally Matched FET

File Size 111.18K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    AT1314 AT1314S-GRE

Aimtron Technology Corp.
Part No. AT1314 AT1314S-GRE
Description HIGH-EFFICIENCY STEP-DOWN CURRENT REGULATOR FOR LEDS

File Size 310.11K  /  12 Page

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Amphenol Communications Solutions

Part No. 131-4118-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    KLT-131451S

KODENSHI KOREA CORP.
Part No. KLT-131451S
Description 1310nm InGaAsP strained MQW for FP-LD 1.5mm ball lens TO CAN

File Size 161.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4514-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    FLM1314-12F

Eudyna Devices Inc
Part No. FLM1314-12F
Description X, Ku-Band Internally Matched FET

File Size 303.83K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4216-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    TGI1314-50L

Toshiba Semiconductor
Part No. TGI1314-50L
Description MICROWAVE POWER GaN HEMT

File Size 90.01K  /  2 Page

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Amphenol Communications Solutions

Part No. 131-4518-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    864-03-001 864-03/001 864-03001

Qualtek Electronics Corporation
Part No. 864-03-001 864-03/001 864-03001
Description EMI FILTER

File Size 196.23K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4314-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    4435.0173 4435.0082 4435.0029 4435.0056 4435.0007 4435.0028 4435.0037 4435.0137 4435.0049 4435.0204 4435.0019 4435.0174

Schurter Inc.
Part No. 4435.0173 4435.0082 4435.0029 4435.0056 4435.0007 4435.0028 4435.0037 4435.0137 4435.0049 4435.0204 4435.0019 4435.0174 4435.0471
Description    Circuit Breaker for Equipment thermal, Rocker actuation, 1 pole

File Size 562.43K  /  6 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    NFS-50A-1314BF NFS-34A-1314BF NFS-40A-1314BF NFS-80A-1314BF NFS-60A-1314BF NFS-64A-1314BF

Yamaichi Electronics Co., Ltd.
Part No. NFS-50A-1314BF NFS-34A-1314BF NFS-40A-1314BF NFS-80A-1314BF NFS-60A-1314BF NFS-64A-1314BF
Description B-t-B Socket, 1.27mm Pitch (for NFP Solder Dip Box Header)

File Size 36.76K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4316-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    PCF5083H/5V2/F3 PCF5083H/001/F2 PCF5083H/F2

NXP Semiconductors N.V.
Philips Semiconductors
Part No. PCF5083H/5V2/F3 PCF5083H/001/F2 PCF5083H/F2
Description GSM signal processing IC TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP128
Circular Connector; MIL SPEC:MIL-C-26482, Series I; Body Material:Aluminum Alloy; Series:MS3122; No. of Contacts:39; Connector Shell Size:20; Connecting Termination:Crimp; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No

File Size 617.85K  /  136 Page

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Amphenol Communications Solutions

Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 435-1314-001 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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