Part Number Hot Search : 
TC1N751A TC1N751A LBS70A18 LT1103C N411046 160H40 RY56A M24C16
Product Description
Full Text Search
  0832 Datasheet PDF File

For 0832 Found Datasheets File :: 131+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 |   

    K4S640832K K4S641632K K4S641632K-T K4S640832K-T_UC_L75 K4S641632K-T_UC_L50 K4S641632K-T_UC_L60 K4S641632K-TUC_L50 K4S641

SAMSUNG[Samsung semiconductor]
Part No. K4S640832K K4S641632K K4S641632K-T K4S640832K-T_UC_L75 K4S641632K-T_UC_L50 K4S641632K-T_UC_L60 K4S641632K-TUC_L50 K4S641632K-TUC_L60 K4S641632K-TUC_L75 K4S640832K-TUC_L75 K4S641632K-TUC/L50 K4S641632K-TUC/L60 K4S640832K-TUC/L75 K4S641632K-TUC/L75
Description 64Mb K-die SDRAM

File Size 211.60K  /  14 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-201509LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    74AUP1G0832 74AUP1G0832GF 74AUP1G0832GM 74AUP1G0832GW

NXP Semiconductors
Part No. 74AUP1G0832 74AUP1G0832GF 74AUP1G0832GM 74AUP1G0832GW
Description Low-power 3-input AND-OR gate

File Size 79.35K  /  16 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-203600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    74AUP1G0832GF 74AUP1G0832GW 74AUP1G0832GM 74AUP1G0832

PHILIPS[Philips Semiconductors]
Part No. 74AUP1G0832GF 74AUP1G0832GW 74AUP1G0832GM 74AUP1G0832
Description Low-power 3-input AND-OR gate

File Size 67.42K  /  19 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-203609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -

File Size 180.64K  /  13 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-204629LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4S510832B-TC75 K4S510832B-TCL75 K4S510432B-TC K4S510432B-TC75 K4S510432B-TCL75 K4S511632B-TC75 K4S511632B-TCL75
Description 512Mb B-die SDRAM Specification

File Size 147.30K  /  15 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-202422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    K4S510832B-CL75 K4S510832B-UC75 K4S510432B-CL75 K4S510432B-UC K4S510432B-UC75 K4S511632B-UC75 K4S511632B-CL75 K4S511632B

http://
Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4S510832B-CL75 K4S510832B-UC75 K4S510432B-CL75 K4S510432B-UC K4S510432B-UC75 K4S511632B-UC75 K4S511632B-CL75 K4S511632B-UC75T
Description 512Mb B-die SDRAM Specification 512MB的乙芯片内存规格
32M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54

File Size 147.74K  /  15 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-202402LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    1-794328-0 1-794328-1 316455-1 1-770901-0 1-794071-0 1-794432-0 1-794432-1 1-2110832-1 1-2110832-3 1-2110832-8 1-2110832

Tyco Electronics
Part No. 1-794328-0 1-794328-1 316455-1 1-770901-0 1-794071-0 1-794432-0 1-794432-1 1-2110832-1 1-2110832-3 1-2110832-8 1-2110832-2 1-2110832-5 1-2110832-7 1-2110832-0 1-794325-1 1-794327-0 1-794327-1 1-794330-1 1-794325-0 1-794329-1 1-794330-0 1-794326-0 1-794326-1 1-794329-0 794423-1 1-770872-1
Description Mini-Universal MATE-N-LOK Connector System
.163&quot; Centerline, 600 V, 9.5 A max.

File Size 474.84K  /  6 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-204422LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    CL001E08325B0DJ-60 20084C

Fox Electronics
Part No. CL001E08325B0DJ-60 20084C
Description 8M X 32 EDO DRAM MODULE, 60 ns, SMA72 SIMM-72

File Size 758.21K  /  14 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-202409LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

    K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60 K4S561632E-TL75 K4S560432E-TL75 K4S560432E-TC75 K4S560432E-TC
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II

File Size 196.59K  /  14 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 55508-320LF
Description Minitek® 2.00mm, Board to Board Connector, Low Profile, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 20 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Part No. K4S560432E-TC K4S560432E-TC75 K4S561632E-TL75 K4S560432E-TL75 K4S560832E-TC75 K4S560832E-TL75 K4S561632E K4S561632E-TC60 K4S561632E-TC75 K4S561632E-TL60
Description 256Mb E-die SDRAM Specification 256Mb的电子芯片内存规

File Size 194.54K  /  14 Page

View it Online

Download Datasheet

   

Amphenol Communications Solutions

Part No. 61083-202600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 200 Positions.
Tech specs    

Official Product Page

For 0832 Found Datasheets File :: 131+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 |   

▲Up To Search▲

 



Bom2Buy.com




Price and Availability



 
Price & Availability of 0832

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
1.3387298583984